Search Results

resin

SMTnet search results for "resin"


full site search results for resin

Electronics Forums

»

284 threads

Technical Library

»

157 articles

Industry Directory

»

859 companies

New SMT Equipment

»

838 products

Used SMT Equipment

»

6 equipment listings

Parts & Supplies

»

363 parts & accessories

Industry News

»

96 press releases

Events Calendar

»

41 events

Career Center - Resumes

»

2 resumes

Training Courses

»

5 courses

SMTnet SEARCH INCLUSION Results. Include your website too! »

https://www.zestron.com/fileadmin/Filestorage/RESPONSIVE_Website/2-Products/TIs/EN/productinfo-zestron-resintest-en.pdf

Product Information Korea infokorea@zestron.com PR00001533.7 release date: 2020-02-13/ Page 1 of 1 www.zestron.com Test kit for the indication of resin-based residues on PCB assemblies The ZESTRON ® Resin Test visually and temporarily identifies the local distribution of resin-based residues on electronic assemblies via a color reaction . Critical resin residues can cause poor adhesion of conformal coatings and delamination effects. Residues can be localized during the production with the use of the Resin Test and removed by a cleaning step . Thereby meeting the critical resin level of <40 µg/cm² (258.06 µg/sq in) according to J-STD 001. This test complements analytical methods such as Ionic Contamination Measurement ® Resin Test compared to other methods:  Very precise concentration measurement: Localized detection of resin-based contamination on electronic assemblies

Internet:

http://www.zestron.com/fileadmin/Filestorage/RESPONSIVE_Website/2-Products/TIs/EN/productinfo-zestron-resintest-en.PDF

Internet: Resin Test For further technical questions regarding the ZESTRON Resin Test please contact our ZESTRON Application Technology Department: Telefon: +49 (0)841/635-140 Email: techsupport@zestron.com PR00001533.DOC Release Date – C h in a in fo c h in a @ z e s tr o n . c o m S o u th A s ia K u li m – M a la y s ia in fo a s ia @ z e s tr o n . c o m P R O D U C T I N F O R M A T IO N Area of Application for ZESTRON Resin Test The ZESTRON ® Resin Test visually and temporarily identifies the local distribution of resin-based residues on electronic assemblies via a color reaction . Critical resin residues, which cause poor adhesion of conformal coatings and delamination effects can be localized during the production and removed by a cleaning step . Thus the critical resin amount of <40 µg/cm² (258.06 µg/sq in) according to J-STD 001 can be met. This test complements analytical methods such as Ionic Contamination Measurement

PCB Base Material Types- How To Determine The Type

https://www.ourpcb.com/pcb-base-material-types.html

 Types- How To Determine The Type Abstract The three main types of base material include The Resin System The Reinforcement The conductor Content 1. Resin System 2 . Tetra Functional Epoxy Resin 3. Epoxy Blends 4. Bismaleimide Triazine (BT)/Epoxy 5. Cyanate Ester 6. Polyimide 7. Polytetrafluoroethylene (PTFE,Teflon) 8 . Polyphenylene Ether (PPE)   PCB Base Material Types: Resin System: The most common resin is the epoxy resin. There are further other types  of epoxy resin. The epoxy resin is the most successful type used in PCB base material . It offers the mixture of good electrical, physical and mechanical properties . Low cost and comparatively easy to process The epoxy resin is made by the reaction between epichlorohydrin and Bisphenol A. The resultant is di-functional epoxy resin Difunctional epoxies are used in comparatively unsophisticated boards such as simple double sided printed circuit boards

editer editer, Author at PCB Assembly,PCB Manufacturing,PCB design - OURPCB - Page 5 of 6

https://www.ourpcb.com/author/editer/page/5

 include The Resin System The Reinforcement The conductor Content 1.Resin System 2.Tetra Functional Epoxy Resin 3.Epoxy Blends 4.Bismaleimide Triazine (BT)/Epoxy 5.Cyanate Ester 6.Polyimide 7 .Polytetrafluoroethylene (PTFE,Teflon) 8.Polyphenylene Ether (PPE)   PCB Base Material Types: Resin System: The most common resin is [...] By editer editer | 2018-09-12T17:47:14+08:00 February 10th, 2017

Addworks_Case_Study_PKG_LXR_568_web.pdf

https://www.clariant.com/-/media/Files/Business-Units/Additives/AddWorks_Case_Studies/Addworks_Case_Study_PKG_LXR_568_web.pdf?la=de

. While coming out fine in other respects, the resin could not be made to go through the molding process without excessive discoloration, resulting in an end material that showed a too high Yellowness Index (YI ). What the customer needed was the same good-quality resin without this crucial flaw, so it could be made into clear rigid packaging articles of an attractively pure whitish color. customer Needs • A transparent whitish and clean appearing injection molded article • Easy integration of solution into existing process • Improved resin usable for rigid packaging items in attractive clear white color • High speed injection molding with short cycle times soLutioN AddWorks® LXR™ 568 works like an elixir for this customer. When Clariant’s high-performance stabilizer was added to the selected resin and used in the desired process, the result was a much lower discoloration during molding and an end material that showed 17 ® LXR™ 568 SIGNIFICANTLY IMPROVED YELLOWNESS INDEX Resin with AddWorks® LXR™ 568 shows 17% less yellow color Reference -8 -11 -10 -9 -12 -13 -14 AddWorks® LXR™ 568 17

Addworks_Case_Study_PKG_LXR_568_web.pdf

https://www.clariant.com/-/media/Files/Business-Units/Additives/AddWorks_Case_Studies/Addworks_Case_Study_PKG_LXR_568_web.pdf?la=pt

. While coming out fine in other respects, the resin could not be made to go through the molding process without excessive discoloration, resulting in an end material that showed a too high Yellowness Index (YI ). What the customer needed was the same good-quality resin without this crucial flaw, so it could be made into clear rigid packaging articles of an attractively pure whitish color. customer Needs • A transparent whitish and clean appearing injection molded article • Easy integration of solution into existing process • Improved resin usable for rigid packaging items in attractive clear white color • High speed injection molding with short cycle times soLutioN AddWorks® LXR™ 568 works like an elixir for this customer. When Clariant’s high-performance stabilizer was added to the selected resin and used in the desired process, the result was a much lower discoloration during molding and an end material that showed 17 ® LXR™ 568 SIGNIFICANTLY IMPROVED YELLOWNESS INDEX Resin with AddWorks® LXR™ 568 shows 17% less yellow color Reference -8 -11 -10 -9 -12 -13 -14 AddWorks® LXR™ 568 17

PCB Epoxy Resin and Hardner for PCB Repair | Soldertools.net

http://www.soldertools.net/pcb-repair-epoxy-resin-and-hardner/

PCB Epoxy Resin and Hardner for PCB Repair | Soldertools.net arrow-right arrow-left chevron-down close basket account search wishlist star spinner check-mark grid list lock plus BEST soldering geeks enable electronics companies to be more effective through . Home PCB Repair Materials Replacement Parts PCB Repair Epoxy Resin and Hardner PCB Repair Epoxy Resin and Hardner $10.00 SKU: PCB Repair Epoxy Resin/Hardner Availability : $0.00 View cart Checkout New Wishlist Wishlist Name * Make wishlist public Create Wishlist Description Reviews Videos Description Description PCB Repair Epoxy Resin/Hardner Resin/Hardner, Single Use

http://www.soldertools.net/content/Epoxy%20Resin%20SDS%20V12122018.pdf

1/25/2019 SDS Ref.: Epoxy Resin 1/5 Epoxy-Resin SECTION 1: PRODUCT AND COMPANY IDENTIFICATION Product Name: Epoxy Resin Distributor • Trade secrets on exacting percentages 1/25/2019 SDS Ref.: Epoxy Resin 2/5 SECTION 4: First aid measures Inhalation: Move to fresh air. Get medical attention if necessary Eye Contact . Store away from incompatible materials. Avoid mixing resin ({Part A) and curing agent Part B) unless you plan to use immediately. Failure to observe these precautions may result in excessive heat .: Epoxy Resin 3/5 SECTION 11: TOXICOLOGICAL INFORMATION Relevant routes of exposure: Skin, inhalation, eyes, ingestion. Inhalation: May cause irritation to nose and throat . Although certain hazards are described herein, we cannot guarantee that these are the only hazards which exist. 1/25/2019 SDS Ref.: Epoxy Resin 4/5

Aquanox A4625 | Kyzen: Eco-Friendly Cleaning Products, Industrial Cleaning Solutions

https://www.kyzen.com/products/aquanox-a4625/?lang=de

. The solvents were selected on their ability to dissolve rosin and resin structures. The solvents provide a unique hydrophobic (rosin/resin loving) and hydrophilic (water loving) balance. The operating concentration range for water soluble soils is 5-10 °F provide high affinity for non-polar resin and rosin structures. Aquanox A4625 contains low levels of a polar organic reactive solvent with one side of the molecule inducing the ion-dipole on non-polar resins and the other portion of the molecule providing dispersive forces

Aquanox A4625 | Kyzen: Eco-Friendly Cleaning Products, Industrial Cleaning Solutions

https://www.kyzen.com/products/aquanox-a4625/

. The solvents were selected on their ability to dissolve rosin and resin structures. The solvents provide a unique hydrophobic (rosin/resin loving) and hydrophilic (water loving) balance. The operating concentration range for water soluble soils is 5-10 °F provide high affinity for non-polar resin and rosin structures. Aquanox A4625 contains low levels of a polar organic reactive solvent with one side of the molecule inducing the ion-dipole on non-polar resins and the other portion of the molecule providing dispersive forces

YAMAHA Cylinder KV7-M9283-00X - QYSMT

https://www.qy-smt.com/product-item/yamaha-cylinder-kv7-m9283-00x/

. KV8-M7162-00X SOLENOID VALVE(UNIT) 93604-06083 PIN DOWEL KV8-M7163-01X EJECTOR,RESIN 90250-04J08 PIN PARALLEL KV8-M7163-01X EJECTER,RESIN 99480-04008 PIN,PARALLEL KV8-M71V9-00X COVER 90110-03248 BOLT

YAMAHA VALVE A0404E1-56W - KV8-M7162-10X - QYSMT

https://www.qy-smt.com/product-item/yamaha-valve-a0404e1-56w-kv8-m7162-10x/

HEX.SOCKET HEAD 90990-02J005 SET SCREW M3X2 KHY-M7151-00 EJECTOR,RESIN 90990-08J016 SCREW,PAN HEAD KHY-M4592-01 VAC SENSOR BRD ASSY You Might Like These YAMAHA-YV88X-HALF-MIRROR

UV Curing Materials Adhesive Dispensing Pumps

http://www.gpd-global.com/co_website/fluiddispense-appsol-uvcuring.php

Contacts Technical Support About Company Profile News Events Awards Employment » Applications » UV Curable Materials UV Curing Materials Adhesive Dispensing Pumps Adhesive Dispensing Pumps UV Cure Resin, Epoxy, and Glue UV Curable adhesives such as resin, epoxy, and glue are adhesives cured under UV light

UV Curing Materials Adhesive Dispensing Pumps

http://www.gpd-global.com/co_website/fluid-dispense-curing-application.php

Contacts Technical Support About Company Profile News Events Awards Employment » Applications » UV Curing UV Curing Materials Adhesive Dispensing Pumps Adhesive Dispensing Pumps for UV Curing - Resin, Epoxy, and Glue UV Curable adhesives such as resin, epoxy, and glue are adhesives cured under UV light

Yamaha YS24 Vacuum SMC Solenoid Valve KHY-M7153-01 KOGANEI JA10AA-21W

http://www.smtspare-parts.com/sale-10367168-yamaha-ys24-vacuum-smc-solenoid-valve-khy-m7153-01-koganei-ja10aa-21w.html

: KHY-M7153-01 3, Model: JA10AA-21W   KHY-M7151-00 EJECTOR,RESIN 1-1 KHY-M7151-01 EJECTOR,RESIN 2 KHY-M4592-01 VAC SENSOR BRD ASSY 3 KHY-M71CA-00 COVER,VAC SENSOR 4

Yamaha YS24 Vacuum SMC Solenoid Valve KHY-M7153-01 KOGANEI JA10AA-21W

https://www.smtspare-parts.com/sale-10367168-yamaha-ys24-vacuum-smc-solenoid-valve-khy-m7153-01-koganei-ja10aa-21w.html

: KHY-M7153-01 3, Model: JA10AA-21W   KHY-M7151-00 EJECTOR,RESIN 1-1 KHY-M7151-01 EJECTOR,RESIN 2 KHY-M4592-01 VAC SENSOR BRD ASSY 3 KHY-M71CA-00 COVER,VAC SENSOR 4

Orange Sticks & Non-metal Probes, Wiring Aids

http://www.beautech.com/nonmetal.cfm

") Package of 100 Orange Sticks The Beau Tech orange sticks are made of high quality non-resin wood which will not contaminate solder and component leads

Orange Sticks & Non-metal Probes, Wiring Aids

https://www.beautech.com/nonmetal.cfm

") Package of 100 Orange Sticks The Beau Tech orange sticks are made of high quality non-resin wood which will not contaminate solder and component leads

Microsoft Word - 35D_TDS_b.doc

https://qualitek.com/wp-content/uploads/2017/06/35Defoamer.pdf

. Simply spray 35 Defoamer onto the boards before they enter the wash operation. Process Control While 35 Defoamer is designed not to harm resin beds in closed loop systems, it will most likely be filtered out

Microsoft Word - 35D_TDS_b.doc

http://qualitek.com/wp-content/uploads/2017/06/35Defoamer.pdf

. Simply spray 35 Defoamer onto the boards before they enter the wash operation. Process Control While 35 Defoamer is designed not to harm resin beds in closed loop systems, it will most likely be filtered out

EMPFasis - Vol. 3 - No. 2

https://store.aciusa.org/EMPFasis-Vol-3-No-2-P212.aspx

: New JSF RF Tuner System Decreases Cost and Increases Bandwidth Message from the Director New Conductive Epoxy Resin Leads to Cost Reduction of RF Tuner Systems for JSF Services and Training Overview Digital Download

Plural Components Packaging Techkit

http://www.techconsystems.com/en/2k-packaging/techkit/?sef_rewrite=1

 –   $ 0 1 Advanced Techkit Plural Components Packaging Techkit  The Techkit is a compact and simple method of packaging two or three component resin systems into a 2.5oz (74ml), 6oz (177ml), 8oz (237ml), 20oz (591ml) or 1/10 gallon (325ml) cartridge . Use with Techcon Systems cartridge dispensing guns. When the job has been completed, the entire package is disposed of: no clean up or physical contact with the resin

Plural Components Packaging Techkit

http://www.techconsystems.com/en/2k-packaging/techkit/

 –   $ 0 1 Advanced Techkit Plural Components Packaging Techkit  The Techkit is a compact and simple method of packaging two or three component resin systems into a 2.5oz (74ml), 6oz (177ml), 8oz (237ml), 20oz (591ml) or 1/10 gallon (325ml) cartridge . Use with Techcon Systems cartridge dispensing guns. When the job has been completed, the entire package is disposed of: no clean up or physical contact with the resin

Semiconductor Processing Equipment | LEL International

https://www.wearelel.com/semi/buy/semiconductor-processing-equipment

. PhotoMasking: Molds the elements of the wafer to the proper shape using resin and masked light exposure. After the wafer is softened by the resin exposed to the light, it is cleaned and ready to be processed. Wafer Probing

Used Critical and Semiconductor Equipment Seller… | LEL International

https://www.wearelel.com/semi/buy/semiconductor-processing-equipment/sold

. PhotoMasking: Molds the elements of the wafer to the proper shape using resin and masked light exposure. After the wafer is softened by the resin exposed to the light, it is cleaned and ready to be processed. Wafer Probing

Seika Machinery, Inc. Introduces Application to Remove Moisture from Cell Phones | Seika Machinery,

http://seikausa.com/news/seika-machinery-inc-introduces-application-remove-moisture-cell-phones

. McDry cabinets are proven to be the quickest and most reliable method for removing moisture from cell phones. The heating temperature from blow or air dryers is known to cause damage of electronics components and resin parts

26761_Seika_final

http://seikausa.com/sites/default/files/documents/mcdry-ultra-low-humidity-storage-cabinets.pdf

. Ambient Storage Surface peeling between the die pad and the resin is caused by water vapor pressure during reflow. Reflow Soldering The high temperatures involved in vapor phase or reflow soldering cause the absorbed moisture to expand rapidly, thus causing internal stress known as “Popcorning

PCBA conformal coating machine-PCB magazine loader,PCB Multi Magazine Loader,pcb conformal coating m

https://www.ascen.ltd/Video_Channel/Non-standard_equipment/595.html

: from external environmental factors,vibration or fluctuations intemperature,by applying a fluid resin matrix.   Manufacturer: ASCEN technology   Providing unique PCB conformal coating machine for all of the different coating material technologies is one of ASCEN Technologies

White Paper Template

https://www.okinternational.com/File%20Library/Metcal/Resources/White%20Papers/Risk-Mitigation-in-Hand-Soldering-RRoush.pdf

-Hole Component, 1/4W Axial Lead Resistor, Figure 6 The solder joint exhibited proper wetting to both the lead and PCB interface as evidenced by the sufficient IMC formation. Resin recession and PCB delamination observed. Resin recessed can be described

White Paper Template

http://www.okinternational.com/File%20Library/Metcal/Resources/White%20Papers/Risk-Mitigation-in-Hand-Soldering-RRoush.pdf

-Hole Component, 1/4W Axial Lead Resistor, Figure 6 The solder joint exhibited proper wetting to both the lead and PCB interface as evidenced by the sufficient IMC formation. Resin recession and PCB delamination observed. Resin recessed can be described

Kapton Polymide Film

http://orionindustries.com/pdfs/kapton.pdf

® Type HN over a wide temperature range. This is achieved by combining Type HN with DuPont Teflon® FEP fluorocarbon resin in a composite structure ® conforms to ASTM D-5213-95, Standard Specification for Polymeric Resin Film for Electrical Insulation and Dielectric Applications. Underwriters Laboratories, Inc ). As-Received Strength (Cold Peel) of Bonds Between Kapton Type HN and Teflon Layers The bond between the Kapton® Type HN and Teflon® fluorocarbon resin layers on all Type FN products except 120FN616 and 120FN616B will have a minimum peel strength of 225 g/in (0.87 N/cm polymers in the form of a film. Kapton® Type FN film is a combination of Type HN film with Teflon® FEP fluorocarbon resin on one or both sides. Uniformity Material shall be uniform in composition and free from defects that impair serviceability

Pad Repair | Circuit Trace Repair | Surface Mount Pad - BEST

https://www.solder.net/services/pcb-repair/pad-and-trace-repair/

. In a study summarizing a variety of adhesion techniques for the repair of printed circuit board traces, the 2-part resin hardener epoxy system has been shown to yield the best results

IPC A-600 Certified IPC Specialist (CIS) Course at BEST Inc.

https://www.solder.net/training-courses/ipc-a-600-cis-training/

for etchback, voids, and resin recession Acceptance criteria for flexible, rigid-flex and metal core printed boards This is a 3-day, lecture only course that teaches students the accept/reject criteria

Call for Papers | SMTA International

https://www.smta.org/smtai/call_for_papers.cfm

, & Electronics New Materials and Processes Optoelectronics Plastic 3D PCB to PCB Technology Power or Thermal Management Power Electronics Printed Electronics Technology Reliability of Nanodevices Resin

https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=191216091207

Production Michael Kövi, *Helmut Schweigart, Ph.D., ZESTRON Corporation Inemi Project on Process Development of Bisn-based Low Temperature Solder Pastes - Part Vi: Mechanical Shock Results on Resin Reinforced Mixed Snagcu-bisn Solder Joints of Fcbga Components

Call for Papers | SMTA International

http://smta.org/smtai/call_for_papers.cfm

, & Electronics New Materials and Processes Optoelectronics Plastic 3D PCB to PCB Technology Power or Thermal Management Power Electronics Printed Electronics Technology Reliability of Nanodevices Resin

Symposia | SMTA International

http://smta.org/smtai/symposium.cfm

., Auburn University Factors Impacting the Reliability of Ultra-Low Silver Lead-Free Alloys Brian Toleno, Ph.D., Neil Poole, Ph.D., Mark Curie, Ph.D., Henkel Electronic Materials LLC Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups Formed by Reflow Soldering SAC Solder Ball BGAs with BiSnAg and Resin Reinforced

SMT PCB Assembly - Online PCB Quote - Full feature custom PCB prototype service at low cost -PCBWay

https://www.pcbway.com/quotesmt.aspx

Half-cut/Castellated Holes Edge Plating Impedance control Buried/blind vias Custom Stackup Carbon Mask Via in pad Via filled with resin Countersinks/Counterbores Z-axis milling Detailed information of PCB: Attention please

SMT PCB Assembly - Online PCB Quote - Full feature custom PCB prototype service at low cost -PCBWay

https://www.pcbway.com/quotesmt.aspx?f=fb

Half-cut/Castellated Holes Edge Plating Impedance control Buried/blind vias Custom Stackup Carbon Mask Via in pad Via filled with resin Countersinks/Counterbores Z-axis milling Detailed information of PCB: Attention please

SpaceSelectionScheduleforpdf.xlsx

http://www.ipcapexexpo.org/files/2019-space-selection-schedule.pdf

 & Crew, Inc. Tuesday  June 5, 2018 2:00 pm ‐ 3:00 pm  A021 APEX Keysight Technologies Tuesday  June 5, 2018 2:00 pm ‐ 3:00 pm  A025 APEX United Resin Corporation Tuesday  June 5, 2018 2:00 pm ‐ 3:00 pm  A026 APEX CheckSum

IPC APEX EXPO 2019 - Conference Brochure

http://www.ipcapexexpo.org/files/IPC-APEX-EXPO-2019-Conference-Brochure.pdf

................................... 1253 Tronex Technology, Inc. ..........1035 U.S. Tech .................................. 2120 Ucamco USA ............................... 118 UL LLC .........................................718 United Resin Corporation ........2532 Unitron Luxo

Unisoft - Customers - Manufacturing software for electronic manufacturers EMS, CEM & OEM - PCB assem

https://www.unisoft-cim.com/customer.html

Circuit Assembly Corporation* Philips Electronics North America Corporation Pioneer Plexus Incorporated CA* Plexus Incorporated MA* PlumtroniX LLC* Pole Zero Incorporated Polymer Injection Molding Corporation Polymer Liquid Resin Casting Corporation Polymer

Unisoft - Customers - Manufacturing software for electronic manufacturers EMS, CEM & OEM - PCB assem

http://www.unisoft-cim.com/customer.html

Circuit Assembly Corporation* Philips Electronics North America Corporation Pioneer Plexus Incorporated CA* Plexus Incorporated MA* PlumtroniX LLC* Pole Zero Incorporated Polymer Injection Molding Corporation Polymer Liquid Resin Casting Corporation Polymer

IPC TM-650 Test Methods Manual | IPC

http://ipc.org/test-methods.aspx

2.3.14 Print, Etch, and Plate Test - 4/73 TM 2.3.15D Purity, Copper Foil or Plating - 5/04 TM 2.3.16B Resin Content of Prepreg, by Burn-off - 12/94 TM 2.3.16.1C Resin Content of Prepeg, by Treated Weight - 12/94 TM 2.3.16.2 Treated Weight of Prepreg - 12/94 TM 2.3.17D Resin Flow Percent of Prepreg - 8/97 TM 2.3.17.2B Resin Flow of "No Flow" Prepreg - 8/97 TM 2.3.18A Gel Time, Prepreg Materials - 4/86 TM 2.3.19C Volatile Content of Prepreg - 12/94 TM - 1/95 TM 2.4.48 Spitting of Flux-Cored Wire Solder - 1/95 TM 2.4.49 Solder Pool Test - 1/95 TM 2.4.50 Thermal Conductivity, Polymer Films - 7/95 TM 2.4.51 Self Shimming Thermally Conductive Adhesives - 1/95 TM 2.4.52 Fracture Toughness of Resin Systems

Committee Home Pages | IPC

http://ipc.org/CommitteePage.aspx

Subcommittee 3-12a Metallic Foil Task Group 3-12c Resin Coated Foils Task Group 3-12d Woven Glass Reinforcement Task Group 3-12e Base Materials Roundtable Task Group 3-12i Strategic Raw Matls Supplier

Microsoft Word - Formulation Considerations for Automated Dispensing of Lea–

http://www.nordson.com/en-us/divisions/asymtek/Documents/Papers/2004_03%20_automated_dispensing_lead_free_solder_paste_NordsonASYMTEK.pdf

. The activators comprise approximately 0.5% of the total volume of the flux. Approximately 75% of the flux is composed of a synthetic resin or nature rosin that serves as a base for the flux * *30 g. not tested Solvent Other additives Activators Resin or Rosin Figure 1. Flux components 4 Q = Total flow rate µ = Material viscosity in needle P2

DamFillEncap Nepcon99

http://www.nordson.com/en-us/divisions/asymtek/Documents/Papers/1999_02_damfillencap_NepconWest_NordsonASYMTEK.pdf

. One of the main advantages of liquid resin encapsulation is obtained from the flexibility of dispensing systems, which enables package formats to be changed rapidly the wires is 70 microns. Fluid can build up in these areas, causing voids in the encapsulation or resin-rich areas, which will have different coefficients of expansion when compared to other parts of the package. Minimum space between bond wires: Figure 10 from 1 to 1,000,000 centipoise (see Figure 12). These pumps work on the principle where the amount of material dispensed is directly DAM PCB Dispense Cone Potential Void Sites Resin Rich zone if a fluid with large fill particles is used Figure 11 are used. However, this can lead to the filler in the encapsulation materials settling over time causing a gradient effect in epoxy fill with layers of high filler content and resin-rich areas. This will result in different expansion rates through the body

Imagine your company on top of search results!
Voidless Reflow Soldering

Facility Closure