Electronics Forum | Tue Aug 13 10:26:05 EDT 2002 | lloyd
I am currently running several SMT lines that are placing components onto dispensed adhesive (Heraeus PD 944). My problem is that we have always had an issue with a resin type liquid �condensing� on the inside of our oven chimney and then running bac
Electronics Forum | Tue Aug 13 16:47:22 EDT 2002 | mick
The residues are from the flux, not adhesive. Do you have flux management system in oven? You also need to check the flux type = can you use low solids. The effect is the same as steam in bathroom - it is cooling affects in exhaust and flux reforming
Electronics Forum | Wed Aug 14 02:50:49 EDT 2002 | fastek
I hated no-clean for that reason. Yea, the boards are pretty clean and in many cases don't need cleaning but it's not worth it when you consider what it does to your ovens in my opinion. Do water soluable fluxes cause the same havoc in a re-flow?
Electronics Forum | Wed Aug 14 03:14:39 EDT 2002 | lloyd
Thanks for the replys'. So are you saying that SMD adhesive contains a flux agent?, because at this point in the process the boards have no solder on them at all, it's all done at a solder bath after the chips have been bonded.
Electronics Forum | Mon Aug 19 04:48:27 EDT 2002 | surachai
I'm not found this problem with adhesive but found in NC flux , Then you should get some residue and analyse it by SEM and EDX for specify the actual source ( flux or adhesive ? ) , if it 's from adhesive , sometime your supplier must join this pro
Electronics Forum | Wed Aug 14 10:01:42 EDT 2002 | davef
No. Since most glues don't don't give-up many solids, we're [at least I am] speculating that you are using the same oven for both reflow and glue cure and that the 'slime oozin' out from your TV set' [FZ 'Overnight Sensation']. Ooops, no the slime