Electronics Forum: resin on leadframe (Page 1 of 2)

Delamination on IS410 laminate

Electronics Forum | Tue Jul 31 15:33:30 EDT 2007 | gregs110

I have seen a few threads about delamination issues on IS410 laminate in RoHS applications. I have recently been running into a rash of issues on 4 different part numbers with a single PWB source. All the parts have been built fine in the past with

Non-wetting on QFP lead

Electronics Forum | Wed Nov 21 19:45:36 EST 2001 | Yngwie

Hi Guys, I need help. I�ve a trouble with non-wetting problem on the lead of 208 pin, 20 mils pitch QFP. We are on intrusive reflow. I never faced this problem before on this product after running them for about 2 years now. This occurred on one pa

Wire bonding on gold fingers

Electronics Forum | Tue Jul 01 17:38:24 EDT 2003 | jartman

I've faced this several times in the past, and the only real solution is to wirebond before SMT assembly. Everything leaves a residue, and trying to clean a residue off later is basically hopeless. This may require some trickery in your SMT process

DoE on post-reflow PCB - warp

Electronics Forum | Wed Jun 26 08:53:32 EDT 2002 | davef

We have not done a DOE on board warping. Consider: * How close the board gets to its Tg during the reflow cycle * Amount of copper on each side and the balance between the two * Thickness of the board * Overall length x width * Time at temperature

Affect of Solder Mask on Heat Dissipation

Electronics Forum | Mon Feb 05 10:21:21 EST 2007 | davef

Thermal conductivity [W/m-�C] * Silver: 418 * Aluminum: 403 * Copper [rolled annealed]: 392 * Copper [electrodeposited]: 392 * Gold: 297 * Nickel: 90.7 * Tin: 73 * SAC: 73 * Castin: 57 * Pb37Sn63: 51 * Lead: 35 * Epoxy, phenolic: 25-75 * Conformal co

Flux Residues on Wave Soldered PCBAs

Electronics Forum | Fri Jul 29 16:20:57 EDT 2016 | davef

"ALPHA® EF-2210 is VOC-free, halide-free, rosin/resin-free, low solids no-clean flux which provides the highest activity of any VOC-free Bellcore SIR compliant flux for defect-free soldering. "[2016 Alpha Assembly Solutions] I assume that you're tal

Poor Solderability on TSOPs with Alloy 42 Leadframes

Electronics Forum | Thu Jun 23 00:28:42 EDT 2005 | KEN

....how does the part perform in a wetting test. Is it solderable on a bench or dip-plating in a pot? If you add flux and heat can you fix your problem assemblies? If yes, plating finish or substrate is not your problem. What flux are you using?

Poor Solderability on TSOPs with Alloy 42 Leadframes

Electronics Forum | Wed Jun 22 09:12:57 EDT 2005 | bsudak

Our manufacturing site has been struggling with soldering Alloy 42 TSOPs. Currently, we have to hand solder in one of our applications. Here are the particulars. Component: 54 leads, Sn plated, 400microinches +/-200. Process: Eutectic 63/37 Sn/Pb

Poor Solderability on TSOPs with Alloy 42 Leadframes

Electronics Forum | Wed Jun 22 09:42:51 EDT 2005 | davef

Not sure what a higher Tg laminate will accomplish. Can't hurt though. Remember, when soldering to Alloy 42, the surface is 42% nickel. So, you need to raise the reflow temperature some 15 to 20*C over what is needed for copper. Also, sometimes All

Poor Solderability on TSOPs with Alloy 42 Leadframes

Electronics Forum | Mon Jul 04 09:01:22 EDT 2005 | Rob

Hi, I don't know if it will help but we talked about soldering Nickel on this thread: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=8051&#Message31803 where we used Cobar solder paste for soldering all types of

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