Electronics Forum: resistor

UIC GSM and NiPdAu pads

Electronics Forum | Mon Oct 19 15:43:37 EDT 2009 | dilogic

We have a problem with QFN IC's with NiPdAu plated pads. Our ULC's don't see the pads due to the almost ideal reflection. Vision sees the pads almost black. As we don't have OAL-cameras (which can help in this case, I assume), I am thinking of back-l

Pick and Place machine dropping parts

Electronics Forum | Mon Jul 13 13:48:37 EDT 2009 | christian01976

Hello! You can check your vacuum in MANUAL and then VACUUM IN MONITOR. You can switch the vacuum on or off for each head. With a TYPE 72 nozzle and no component the vacuum should be around 80 or 90 and with a component at the nozzle it should be ove

0201 Land Pattern and Aperture Shape Design

Electronics Forum | Thu Mar 10 09:13:15 EST 2005 | davef

From http://www.IPC.org ... IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, includ

"Gap" in completed solder joint between lead and pad

Electronics Forum | Thu Nov 30 15:19:56 EST 2006 | CK the Flip

Mike, dude, I feel your pain. Hearing stories like this makes my blood boil! It's almost as ridiculous as a customer who told me to put more solder paste on a MELF component to overcome noise issues - he used more solder paste as antennas to overco


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