Electronics Forum: rework (Page 111 of 302)

Flux burn off

Electronics Forum | Wed Jul 20 16:02:05 EDT 2005 | Inds

guys, I am having a problem. During my rework (SRT) process, I am trying to reach a board temp of 150degC b4 the top heater comes down for the actual rework process. Due to which the flux (tacflux 20)is burning off and i am seeing lot of non wetting

Fine Pitch Rework

Electronics Forum | Wed Aug 17 16:09:08 EDT 2005 | pjc

A skilled hand-soldering operator can easily do the rework. Applying liquid flux and raking the iron tip across the leads removes bridges. Removal and replacement of QFP-64 can be done manually. This is of course for very low volume of this type QFP-

Need Help for CCGA Rework

Electronics Forum | Mon Oct 31 19:03:49 EST 2005 | myu

We need to rework for CCGA1657 (Ceramic Column Grid Array): removal and soldering. Its size: 42.5 x 42.5 mm. Its height is 7.25 - 9.61 mm. We use 63Tin-37Lead water-soluble paste. Our mini-stencil is 6-mil with 27 mil apertures. Please show your expe

does copper wire become thinner when it dip to leadfree solder?

Electronics Forum | Wed Nov 02 21:58:17 EST 2005 | KEN

Copper wire will become thinner when dipped in tin/lead or lead free solder. The copper is disolved off of the bulk wire. This is one reason rework on solder pots must be restricted. Eventually, after repeated cycles you will have smaller and sma

Lead Free Inspection/Rework/Hand Soldering Training

Electronics Forum | Tue Jan 03 09:23:31 EST 2006 | Amol Kane

Hi all, Firstly, Wishing everyone a happy new year and a successful transition to RoHS (exempt entities please disregard the later part :-)) I am looking for a formal training institute/organization to train my operating personnel for lead-free hand

PACE TF1500 or 1700 BGA Rework feedback

Electronics Forum | Tue Apr 25 07:44:39 EDT 2006 | Holly

MikeL, I came across your post. We are also a small company looking at rework systems for BGA/QFN/CSP. .5mm worse case pitch. We had a PACE 1700 on trial and we found it clunky and unreliable. We also evaluated a PDR 410 system and found it better

Question on Thermal Overstress on BGA Balls During Rework

Electronics Forum | Tue Mar 28 17:10:25 EST 2006 | mikecollier

I unfortunately cannot post any photos, the unit in question is classified. And, as far as my comment that the BGA profile can be manipulated, if an engineer is also working the process with one of the operators, they can override the profile at any

Very Low Volume BGA Assembly

Electronics Forum | Tue May 23 09:55:47 EDT 2006 | TMC

Do you have an automated line with pick and place equipment that can handle your BGA's? Inspecting the board is a must after profile development. You may send the 1st board to a CEM for X-ray inspection. If you have a consistent process (printin

DFM for Wave

Electronics Forum | Mon Jul 17 16:38:41 EDT 2006 | dave

Guys, My problem is that I have a 10 up panel and I have to use a selective pallet to run it thru the wave process due to SMT on bottomside. However the yields are very poor. We have done everything to improve them with some good improvements along

Flux or Solder Paste?

Electronics Forum | Sun Oct 29 22:47:03 EST 2006 | LMPH

We are going to start doing rework of Lead Free BGA's. Have always used flux for SN/Pb boards/BGA's with good results. Can flux be used fro lead free as well? Boards were originally assembled using lead free paste and components. Hence, the BGA w


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