Electronics Forum: rework (Page 206 of 302)

Non-wetting on QFP lead

Electronics Forum | Mon Nov 26 20:15:50 EST 2001 | davef

Sounds like you are thinking correctly. I'd guess your fab has gotten "smart" and changed your bare board, as you suggest. So, you've got two choices: 1 Rework the QFP. 2 Remove the lower temperature PTH components and solder them to the board some

Contract Manufacturing start up Business

Electronics Forum | Fri Jan 11 00:12:57 EST 2002 | caldon

Pick a niche i.e. Fiber cable splice or BGA replacement service. There are tons on EMS providers and with very cut throat prices. I gaurentee you if you had a BGA rework station and an xray - and offered services in this area you will make a killing

Circuit/Trace cutting

Electronics Forum | Sat Mar 16 18:06:31 EST 2002 | davef

First, you're correct. Trace repair and rework is not for the faint of heart or novices. Second, our "girls" prefer a dental drill type tool [Dremel Flexshaft], rather than the clumsy Dremel type from Wal-Mart. They also like a vice with a unversa

Thousands of TSOP or VSOP To be replaced after assembly

Electronics Forum | Tue Mar 19 10:27:06 EST 2002 | amir

in regards to repairing all these boards, do they consider the end cost of the product whether it's worth it to do so or not? if it does, would you be able to do it in house? and how labor intense is the job? there are machines out there for mass rep

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Thu Aug 08 16:41:18 EDT 2002 | davef

On our last thing like that [5X5, 32, er 28?], we printed bumps on the QFN, but you can't do that, so there's no sense in tormenting you. Ideas that come to mind are: * Search around SMTnet for a paper by Chrys Shea on controlling dispense shots as

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Fri Aug 09 11:59:31 EDT 2002 | bcceng

Tom, I developed a process for applying solder bumps on BCC32 and BCC48 successfully on my previous employer. The quantities were in the thousands a week, the following process is what I was using: Insert BCC's on process carrier (carrier holds 500

BGA process requirements

Electronics Forum | Fri Apr 19 09:41:45 EDT 2002 | angiewest

We have been building BGA's for a couple of years. We even use a Universal Omni 4766 to place them with. Reflowing is where I thought we may have problems, Since we have an IR oven. But we bought a .010" thermocouple from Omega to measure the BGA

Temporary Stencil for MPC555 PBGA

Electronics Forum | Thu May 30 11:12:38 EDT 2002 | robbied

If I get you right and you are looking for a micro stencil for bga rework, then you should try http://www.circuittechctr.com. They are offering a free sample of their Flextac micro stencils in a wide range of sizes. The thing with these ones is that

AOI vs AXI

Electronics Forum | Wed Jun 12 11:14:57 EDT 2002 | pjc

Sam, Like I said, AOI for pre-reflow inspections is the easiest to program and maintain. Each vendor of AOI has its pluses and minuses for programming and performance. Do a careful investigation of each vendor to learn about their machine performanc

Comparison between Glue & solderpaste process

Electronics Forum | Sat Jun 22 21:06:27 EDT 2002 | jersbo

I agree with PJC.. The mention of 2 QFPs to wave = more than likely rework to remove bridges and a potential to scrap the board, 25mil isnt as bad as 20 or less.. but the potential is still very real.$$$$$$ reflow/reflow is my 2 cents with the possib


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