Electronics Forum: rework (Page 266 of 293)

Re: BGA collapse during reflow

Electronics Forum | Mon Jul 12 12:28:10 EDT 1999 | Wolfgang Busko

I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

Re: BGA collapse during reflow

Electronics Forum | Wed Jul 14 14:05:52 EDT 1999 | KT

I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

Re: BGA fab: what's reasonable practise for double sided PCB?

Electronics Forum | Thu Jul 15 17:53:34 EDT 1999 | Boca

I'm designing a board where the parts will only fit if I do one of the following: 1. Put BGAs on both sides 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA pa

Re: uBGA

Electronics Forum | Mon Jul 12 14:30:37 EDT 1999 | Earl Moon

Hi all , We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: 1. Is underfill required for micro-BGAs? 2. What type of stencil apertures are the industry standards for uB

Re: uBGA

Electronics Forum | Tue Jul 13 13:28:18 EDT 1999 | Upinder Singh

Hi all , We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: 1. Is underfill required for micro-BGAs? 2. What type of stencil apertures are the industry st

Re: How to start a selective soldering process

Electronics Forum | Tue Jul 20 11:33:55 EDT 1999 | Ted Kress

I'm planning to introduce selective point-to-point soldering for pwb. This is due to various needs: PIHs assy on double IR, for example. I think the most suitable solution is a point-to-point soldering, 'cause we're still having small lot/many ty

Re: THE ANSWER FOR MR. EARL MOON

Electronics Forum | Fri Jul 23 09:01:36 EDT 1999 | Earl Moon

HI Earl Thank you for your answer. Let me know you about the hot you mentioned First of all, The rework machine is the BGA3500 (manufactured by 0.k international:U.S.A) ��DESOLDERING HEAT :OVER 200��(CENTIGRADE),30SEC(CHECKED

Re: SMD Inspection and Touch-up

Electronics Forum | Fri Jul 23 12:38:33 EDT 1999 | Earl Moon

There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performing

Re: Paste Printing @ 45 degrees

Electronics Forum | Sat Aug 14 07:01:44 EDT 1999 | Earl Moon

Has anybody adopted the method of stencil printing with the board at a 45 degree angle to the squeegee blade? What are the benefits and drawbacks? I've heard you get better fine pitch results. TX Mark I know we all seek easy/better solut

Serious stuff

Electronics Forum | Wed Aug 18 14:33:40 EDT 1999 | Earl Moon

OK folks, let's get real serious. Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. Anyway, I said it would take another 4 weeks to develop a process


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