Electronics Forum: rework (Page 286 of 293)

Re: Cleaning procedures for Entek-Plus Cu-106A

Electronics Forum | Tue Apr 27 05:23:29 EDT 1999 | Earl Moon

Dave said: So Earl, have you gone honest and haken a real job or is this a consulting project? TTYL Davebert DamnDaveBert, I know you didn't mean to insult such a sensitive one as me, bu

Re: Popcorn @ reflow

Electronics Forum | Thu May 20 19:11:48 EDT 1999 | Earl Moon

hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... your help is greatly appreciated...thanks omat marasigan Deo

Re: Popcorn @ reflow

Electronics Forum | Fri May 21 15:40:58 EDT 1999 | JohnW

hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... your help is greatly appreciated...thanks omat marasigan

Re: Things I Like Without Endorsing

Electronics Forum | Wed Jun 02 23:53:09 EDT 1999 | Dean

To you all for comment and summary, The following things I like without endorsing (PCB/PCBA stuff - outside the great women in my life [many] and without [mostly]): 1) A good set of design rules 2) A good set of design rules meeting pro

Re: Off Pad Printing

Electronics Forum | Mon Jun 28 22:02:13 EDT 1999 | Dave F

Hey there gang, how's it going ? Anyway's here's my probelm, got a new product to build double sided reflow, lot's of so20's and PLcc's 1206's, 0805's the usual stuff. Probelm is all the pad spacing of the 1206's are too big, my component's ar

Re: uBGA

Electronics Forum | Tue Jul 13 15:04:24 EDT 1999 | Scott McKee

Hi all , We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: 1. Is underfill required for micro-BGAs? 2. What type of stencil a

uBGA Square Pads or Lands

Electronics Forum | Fri Jul 16 14:05:04 EDT 1999 | Jim Blankenhorn

Hi all , We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: 1. Is underfill required for micro-BGAs? 2. What type of stencil apertures are t

Re: Air-Vac stuff

Electronics Forum | Thu Aug 19 22:59:48 EDT 1999 | Jeff Ferry

I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the ad

Re: Air-Vac stuff

Electronics Forum | Thu Aug 19 23:56:49 EDT 1999 | Earl Moon

I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the

Re: Air-Vac stuff

Electronics Forum | Fri Aug 20 09:33:51 EDT 1999 | Don Morgenstern

Earl & Jeff Our machine is different than the Electrovert Solder Pak in that it is does not behave like a "volcano". Jeff, please contact me if you have safety concerns as perhaps you also want to consider our equipment. I'm trying a second ti


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