Electronics Forum: reworks percentages (Page 1 of 2)

Use lead-free alloy wire during rework for Leaded Process

Electronics Forum | Tue Nov 07 10:43:25 EST 2006 | muse95

Also, have you considered the possibility that if you solder on an existing joint on a board that was built with SnPb solder, even though you are using leadfree solder wire, you would now contaminate the tip of your soldering iron. If you then start

How to run SMT production with low defects

Electronics Forum | Thu Aug 15 15:44:46 EDT 2002 | dragonslayr

You can't control what you don't measure. You have provided very little detail other than post reflow costs are high. What defects are attributed to problems experienced prior to reflow? Are these random or recurring defects? You will need to put ea

Tenting via(s) under BGA & CSP?

Electronics Forum | Thu Apr 11 19:06:59 EDT 2002 | tmarc

We are using 1mm pitch BGAs with a great quantity of via(s) under the component. Very shortly we will be placing CSPs with .65mm pitch. Our via(s) are solder masked, however we generally have a percentage of them that the masking is thin enough that

Re: reject percentage of assembled circuits after initial test?

Electronics Forum | Fri Jan 08 13:22:11 EST 1999 | Earl Moon

| This is a question for those of you who actually assemble components onto a board. | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall qua

Re: reject percentage of assembled circuits after initial test?

Electronics Forum | Fri Jan 08 21:46:49 EST 1999 | Dean

| | This is a question for those of you who actually assemble components onto a board. | | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall

reject percentage of assembled circuits after initial test?

Electronics Forum | Fri Jan 08 10:11:15 EST 1999 | Tim

This is a question for those of you who actually assemble components onto a board. Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality

Re: reject percentage of assembled circuits after initial test?

Electronics Forum | Mon Jan 11 18:07:55 EST 1999 | Lech Bartnik

| | | This is a question for those of you who actually assemble components onto a board. | | | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your ove

Re: Drying ICs any advice

Electronics Forum | Sun May 17 13:46:30 EDT 1998 | Steve Gregory

Hi All! I've been reading this conversation which prompted me to break out the IPC-SM-786A from the IPC manuals from our parent company in Maryland sent us (we're just starting up in California). It's the Procedures for Characterizing and Handling of

IPC-7912 DPMO

Electronics Forum | Tue May 08 19:28:29 EDT 2001 | mparker

Received my copy of the standard about a month ago. Seems straightforward and gets away from the percentage nightmare. Mark Twain said it best with "There are 3 kinds of lies in this world - lies, damn lies and statistics!!" Now I have some nagging

Large Voids with Via in Pad

Electronics Forum | Tue Apr 13 09:46:39 EDT 2004 | davef

Now, that's different. We misunderstood the problem from your original descrtiption. We thought the voids were showing at the via in the pad. Now, we understand the voids appear to be in the solder balls. Suggestions are: * Search the SMTnet Arch

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