Electronics Forum | Thu Feb 15 21:09:45 EST 2007 | Stephen- SMT engineer trainee
1. Can anyone tell me about the water absorption(wt%) among different PCB((i) RoHS, (ii)non-RoHS, (iii) Halogen free)), I am currently facing the problems of PCB blisters after reflow process. 2. Also, please suggest the baking period/time among dif
Electronics Forum | Fri Jun 15 11:34:49 EDT 2007 | cman
What is the board finish? Did you profile built assy and get the temps on the board with a t/c in the board? DId you drill the BGA and get the t/c at the ball? When the parts came off the board did all of hte solder come off the pads and stay with th
Electronics Forum | Wed Nov 14 20:06:20 EST 2007 | petep
I would like a nicely packaged set of assembly tools (green handles and pouch) for use with RoHS assemblies. I have Green mats, dedicated irons, but would like clearly identifiable tools to better segregate the process. Can any of you provide a Man
Electronics Forum | Wed Dec 05 09:26:56 EST 2007 | ratsalad
Ms. Chunks, You are correct nobody mentioned anything about RoHS. And, right or wrong, our quality department's official stance is that "the only thing about RoHS we have to be concerned about in our industry is Pb". It is not just our quality dep
Electronics Forum | Wed Dec 05 10:46:54 EST 2007 | realchunks
If you only manufacture PC Boards with valid RoHS compliant componenets, then yes, your Pb is your only concern. If you add any type of other fastener, housing, wire, etc... it also must be RoHS compliant to be certified. Too many people focus on "
Electronics Forum | Thu Jul 03 11:22:22 EDT 2008 | grics
Thought you may be interested in a couple of links (if you haven't already seen them) Concerns over RoHS revisions - http://www.emtworldwide.com/article.aspx?ArticleID=17089 RoHS USA - Pushback! http://www.rohsusa.com/
Electronics Forum | Wed Jun 10 08:46:20 EDT 2009 | rgduval
We generally purchase RoHS for all; leaving leaded-only assemblies as the exception. We process leaded and lead-free components together in leaded products with few issues. As long as the customer doesn't mind the mix (I'm sure that some out there
Electronics Forum | Tue Oct 05 14:34:40 EDT 2010 | 18424
I am trying to assess current industry thinking > on the question of whether or not lead-free BGAs > (SAC or other) can or should be soldered in a > tin/lead process. It seems there are differing > opinions on this and I'm wondering what some of
Electronics Forum | Mon Apr 07 11:53:44 EDT 2014 | hegemon
It's right there in front of you. Not enough overall temperature across the board. No wetting issue is evident, just looks like you need to turn up the heat, as Dave has mentioned. SOB has mentioned the issues surrounding the Electrolytic caps, ch
Electronics Forum | Thu Feb 19 19:08:02 EST 2015 | comatose
Ignoring the certification issue for a second, what is the alloy of those two joints? The melting temperature? The strength? And no. You added a single homogenous material (leaded wire solder) later in the process. Adding leaded solder makes it non
