Electronics Forum | Tue May 13 17:53:54 EDT 2014 | anvil1021
Hello Michel...this might be a bit of a battle finding the low thermal EMF material that you are looking for. The first one that comes to my mind is Bismuth Selenium Telluride, with either a nickel or cobalt doping agent. Silver went away from this
Electronics Forum | Fri May 23 09:27:37 EDT 2014 | emeto
Hello, these pads look so clean.....I am not sure you had a good solder connection there. I would check the following. 1. Is the part RoHS in a lead process 2. X -ray boards after reflow(I assume you will see head in pillow) 3. Check for board con
Electronics Forum | Tue Mar 28 14:35:04 EDT 2017 | emeto
I can't believe there is a topic for discussion. Find a way and measure lead contamination(if any)and prove them wrong. This is getting out of control. Having all the billions of gasoline and diesel engines pumping dirt in the air, together with the
Electronics Forum | Fri Nov 02 19:34:19 EDT 2018 | sarason
I am assuming that your application is Automotive. The logic here is that the product has got to at least run for 8 years or more. The prebake removes any moisture that may creep into the product during the wait time. A little moisture combined with
Electronics Forum | Wed Dec 11 16:46:25 EST 2019 | stephendo
From what I understand when ROHS was first implemented the EU planned on testing products. But the EU economy would have shut down if all the physically non-compliant products were pulled. And now it is more showing due diligence. Remember it is poli
Electronics Forum | Fri Dec 27 16:12:54 EST 2019 | anteiv
thank you for reply here is picture of the board https://imgur.com/a/i2MfFBw on the bottom are pins/components which height is about 3-4 mm from bottom of the board we had to increase distance of board from nozzle to make clearance and we increas
Electronics Forum | Thu Jan 30 07:09:34 EST 2020 | jineshjpr
Hi All, I'm using 8 zone reflow for ROHS 0.2mm Thick PCB soldering, but Micro BGA shows voids more than 25%. Is there anybody can suggest for better solder profile. paste- aim m8, SAC 305, T4, Soaking (150-200) - tried 90s, 60s, 45s; TAL (>217)-
Electronics Forum | Mon Dec 06 10:32:35 EST 2021 | jineshjpr
Hi Everyone, Can you please suggest how to achieve 100% solder coverage of two Thermal pads on BRD1260C component..??? Surface finish is OSP Copper & Solder Paste is Sn/Pb 63/37. Component is Gullwing leads type. PCB having 1.60 mm Thickness.Peak Tem
Electronics Forum | Tue Dec 21 12:11:06 EST 2021 | jseewald
You likely have raised belly pads. If possible, do a step-up on the thermal pads to compensate for the additional height of the component in this area. Some reduction/adjustment of the gullwing pads may be necessary, so be prepared for a few iterat
Electronics Forum | Wed Apr 13 21:17:18 EDT 2022 | stephendo
If it was ROHS, I would say that the pads are definitely dissolved away. And it sounds like that is the case here. Your best bet is if it is class 2 and the barrels are at least 50% then push for them to be accepted. If you are trying for more barr
