Electronics Forum: root and cause and solder and splash (Page 1 of 2)

Palladium finish and solder balls

Electronics Forum | Thu Jun 27 11:22:03 EDT 2002 | robbied

Hi there. We have had an out of control reflow oven that has allowed its temperature to fluctuate by up to +/- 20 deg C from set point in very short periods of time. We found the root cause of the problem and fixed it, but by then we had already run

Selective soldering pallets and solder balls

Electronics Forum | Mon Dec 02 12:52:40 EST 2002 | slthomas

We're trying a selective soldering pallet for the first time with mixed reviews. Are solder balls a prevalent problem with this process? Most of them seem to correspond with pallet wall locations....is it too much turbulence from the rotary chip wav

Dye and Pry

Electronics Forum | Sat Mar 15 01:03:10 EDT 2008 | callckq

All, What if BGA solder crack do exist after the shock test? Its happen at the corner of the BGA. Base on your experience, what are the potential root causes? Thanks, Sean

LGA and Solderballs

Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef

J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause

Solder Splash/Balls and Flux Splash/Balls

Electronics Forum | Fri Dec 11 08:56:08 EST 2020 | SMTA-64304223

One of the common causes of solder ballin is also outgassing from the boards have your tested the board for outgassing? Bob Willis

Solder Splash/Balls and Flux Splash/Balls

Electronics Forum | Wed Dec 09 18:51:06 EST 2020 | johndep7

My company has been having issues with a lot of solder balls, solder splash, and flux balls all over a specific board. Now this is one of the only companies that require us not to clean our boards after our work is finished but this is also causing a

Re: SMD Inspection and Touch-up

Electronics Forum | Fri Jul 23 13:09:48 EDT 1999 | Steve

| There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performing

Data for PPM and DPMO Calculation

Electronics Forum | Wed Jul 02 19:10:45 EDT 2008 | arminski

Hi, Say I'm going to calculate my PPM and DPMO, do I have to include in my defects data an item that the root cause is already identified? example is if I have 4 components with Land Design issues (incorrect dimension) and is causing me insufficient

silicone conformal coat and electrical contacts

Electronics Forum | Fri Jan 26 16:47:35 EST 2007 | electronhose

IMHO I would avoid sprayed silicones like the plague. They can travel around your facility and cause solder wetting issues that you will never know the root cause for. Also found this e-drive article on using silicones around motors and relays. Loo

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Dec 11 06:34:24 EST 2019 | ameenullakhan

Hi Everyone, Reducing the top heaters around 10 deg each at last 3 zones of reflow oven. Helped us in achieved little lesser temperature at top connection of the CCGA. And we didn't face any bent. Bridging : Reducing the stencil aperture , has wor

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