Electronics Forum | Mon Feb 23 20:19:15 EST 2004 | greg york
Has anyone ever seen a bulbous joint (on 1 side > of 1 designator) on every board? I checked the > preheat profile at the wave and have played with > dwell times but can't get rid of it. I checked > the archives and didn't find much. Any help wou
Electronics Forum | Thu Dec 19 14:00:24 EST 2019 | kylehunter
True, but with rosin it should protect the joints pretty well right?
Electronics Forum | Wed Apr 06 06:25:56 EDT 2022 | bukas
I had the same looking coating on solder joints when we used rosin in IPA. after switching to water based no clean it never happened again.
Electronics Forum | Tue Jan 09 21:21:22 EST 2007 | behrsam
I am soldering a Germanium Window with a metalized rim to a Ni-Au plated kovar lid. The solder joint needs to be hermetic. I am using 80In solder washer shape preform, but am experiencing lots of voiding when x-rayed, although the joint is sealing.
Electronics Forum | Thu May 06 20:11:46 EDT 2004 | gregoryyork
It does sound like your leads are to long, speeding it up will reduce volume on lead and most will wick up the joint but when slow excess solder is left as long leads will have little flux left to aid drainage when it leaves the wave, thus giving a s
Electronics Forum | Wed Jan 10 17:18:11 EST 2007 | flipit
I am soldering a Germanium Window with a > metalized rim to a Ni-Au plated kovar lid. The > solder joint needs to be hermetic. I am using > 80In solder washer shape preform, but am > experiencing lots of voiding when x-rayed, > although the jo
Electronics Forum | Thu Dec 09 04:53:36 EST 1999 | Glen brain
Hi, It is wavesoldering defect, in single- sided copper board, using alcohol-based rosin flux. It is not a bridging between the protruding leads but a metallic (I think, it is solder) link, varies in dia./thickness, connected the basement of solde
Electronics Forum | Mon Feb 01 16:40:45 EST 1999 | Dave Waddick
I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product is
Electronics Forum | Thu Jan 16 15:55:31 EST 2003 | MA/NY DDave
Hi I have a funny feeling that Mike Konrad and I know each other from IBM-Endicott days, yet I could be wrong. It would be funny?? Mike gave a good answer. The Rosin or Rosin Mildly Activated Flux (RMA) if on the board at ICT (In Circuit Test) wil
Electronics Forum | Fri Jun 01 17:31:17 EDT 2007 | gsala
Thanks Patrick, also IPC-HDBK-001 explains even better then IPC-J-STD-004, but unfortunately not yet infos about flux for L-F soldering.That's why I am trying to get some infos more from experienced people. Some L-F (SAC or SACX) cored wires vendor
