Electronics Forum | Thu Jun 27 23:49:40 EDT 2013 | cedric77
I had a solder paste SAC305 T4, with flux loading of 11.5%. After retrieivng out from fridge(5deg) after 48hrs, the paste turn dry (like dry mud? and after double checking the flux loading it becomes 12.5%. Has anyone ever experience this or any opi
Electronics Forum | Wed Aug 21 17:03:13 EDT 2013 | hegemon
I think your pre-heat temp is a little low for SAC 305 Soldering. Especially with a Pallet. You might want to try to add some time and temp to get the PWB itself preheated up to 150-160C. That should help with the barrel fill. Make sure your board
Electronics Forum | Thu Sep 05 21:58:24 EDT 2013 | davef
Both SN100C and SAC305 are excellent and tested LF alloy formulations that with proper process management will produce good looking and reliable solder connections. "Bright & shiny" solder connections is NOT a good measure of a properly soldered LF c
Electronics Forum | Mon Oct 27 20:01:00 EDT 2014 | rangarajd
Hello, We are facing solderability issues on a particular lot of board. THe Nickel thickness measured with an XRF is around 400 U inches. Spec calls out for 130 u inches Nickel and 3 - 5 U inches gold over it. Assuming there is no porosity on the g
Electronics Forum | Thu Oct 30 21:55:13 EDT 2014 | davef
Why soldering issues? I'd guess the nickel is corroded. It is very difficult to solder to oxidized nickel. Your SAC305 would get kicked all the way down the conveyor by nickel oxide. A lack of Ni-Sn-IMC formation will confirm this dewetting . What's
Electronics Forum | Mon Mar 23 08:04:51 EDT 2015 | kris1128
Has anyone out there experienced selective soldering of a shield that is galvanized rather than tin plated? Our supplier is worried about tin wiskers with the bright tin finish. Soldering with SAC305 and a pretty weak no-clean flux. Sorry, I don't k
Electronics Forum | Thu Nov 23 20:01:05 EST 2017 | myke03o
Hi to all experts, Can anyone advice us what solder alloy to use for thermal cycling products. We are facing a lot of issues using normal solder paste SAC305. After thermal cycling the solder is cracking. Any suggestion is welcome. Thanks in advanc
Electronics Forum | Sat Aug 03 03:28:16 EDT 2019 | alexeyzb
We use SNPb for such applications (PCBA for aircraft). We tried SAC305 but recieve no good quality, so now only SNPb. If you will find good solution - please write. Because now we have some problems with BGA - no SNPb balls. And need to reball (addit
Electronics Forum | Thu Sep 05 11:05:35 EDT 2019 | SMTA-Tony
There are competitors to REL solder alloys from AIM. Tin-Copper-Nickel-Bismuth alloys (Nihon Superior) are an alternative option which do very well in thermal cycle testing. The reflow profiles required are similar to SAC305 profiles. You may als
Electronics Forum | Fri Jan 04 06:28:27 EST 2019 | ameenullakhan
Hi, We are observing solder joint discoloration ( yellow color appearance ) in one of assembly after secondary reflow run. Please provide your valuable feedback. Solder paste : water soluble lead free Alloy : SAC305 Flux : ORM1. Please provide v