Electronics Forum | Tue Jan 30 12:16:47 EST 2007 | pbarton
We are seeing unusual soldered joints when soldering to components with Pt/Ag metallised terminations. At the margin between the bottom of the component termination and the PCB surface there are a number of blowholes in the bulk solder. There also ap
Electronics Forum | Thu Feb 08 08:28:11 EST 2007 | mzaboogie
Good Morning Everyone, We have an application coming up with several BGA's on a RoHS assembly. One is a 25 mil ball on a 40 mil pitch, another is a 15 mil ball on a 40 mil pitch. In the past for leaded assemblies, we have used square apertures for 1
Electronics Forum | Sun Feb 18 16:47:34 EST 2007 | darby
As I stated, the reply was direct from Indium, (thanks to Rich Brooks). The information regarding cool down rates should come from your paste supplier; not an oven supplier; not a generic article on lead free. I just went through the data sheets from
Electronics Forum | Mon Apr 02 09:24:16 EDT 2007 | ed_faranda
I do this ALL the time, and it is pretty much transparent to the process. We have done shake, burn in, and functional tests with our products and we didn't have any issues what so ever. We have had a RoHS complient process for well over 18 months n
Electronics Forum | Tue Jun 05 11:52:01 EDT 2007 | rgduval
We just tested AMTECH's LF4300 with good results. Excellent reflow/profiling capabilities, good processing. And decent cleaning. I say decent cleaning, because we did run into a small issue. While using Qualitek's LF paste, we experienced a lot o
Electronics Forum | Tue Jun 05 20:46:25 EDT 2007 | rfrog
I, too, have finished qualifying the Amtech paste for a dispensing application. We will be experimenting with the component soldering/stencil printing next. The stuff has proven to provide the best of both the no-clean/low solids and water washable
Electronics Forum | Mon Jun 04 18:23:41 EDT 2007 | greggc09
Patrick Q1) Is the test pattern similar to the IPC-B-25? A1) - No - Tests were run on a prototype assembly. Q2) what is the temperature in the test chamber and voltage supplied to the test coupons? A2) 25C with 3.3VDC. Q3) Does this test i
Electronics Forum | Fri Jul 20 08:09:09 EDT 2007 | chrispy1963
In passives I dont know if anything changed at all other than the terminal plating. As for Active components there has been much engineering done to allow for the extra heat needed to liquify say SAC305 or other lead free pastes without damage to th
Electronics Forum | Tue Nov 13 14:11:26 EST 2007 | ratsalad
We use SAC305 for solder paste, and we have been pretty happy with it. When we jumped in to this Pb-free business I was a little nervous due to all the horror stories you hear about the process changes. It's not that big of a deal (at SMT). Over
Electronics Forum | Mon Feb 18 15:20:38 EST 2008 | davef
SN100C contains no phosphorus. It has a dross rate equal or lower than tin-lead solder, where as SAC drosses at 2 to 3 times the dross rate of tin-lead solder. Addition of solder dross inhibitors, such as phosphorus, can be effective inhibitors of