Electronics Forum | Tue May 14 21:40:23 EDT 2013 | ultimatejoker
What is the different between SAC and LF Solder Alloys?I found out that LF38 is SAC105 and LF45 is SAC305. Is it because LF is some standard international name for particular country?
Electronics Forum | Mon Jul 29 09:27:15 EDT 2013 | charliedci
All of our reflow is with room air, 63/37 and SAC305. I believe nitrogen will get you better looking solder joints (shiny, less grainy under magnification), but per IPC, functionality and strength I don't think there is much difference.
Electronics Forum | Thu Dec 01 05:23:55 EST 2016 | stivais
Rob Just wondering - have you made analysis of your solder alloy on a regular basis? We are using SAC305 but stainless steel parts (e.g. a nut or a washer) dissolve quite quickly.
Electronics Forum | Tue Feb 14 10:35:56 EST 2017 | cromaclear
I am posting some pictures of the conteiment, i am using lead free sac305 dolder wire and flux if 2005m http://imgur.com/a/v7KYj
Electronics Forum | Fri Jan 26 12:19:24 EST 2018 | clockwatcher
I'm looking for a No Clean SAC 305 Solder Paste that can be run through our inline wash. No chemicals just DI water.
Electronics Forum | Thu Aug 01 04:57:10 EDT 2019 | ameenullakhan
hi Team, observed component skew during reflow process. Inductor location. I have attached the image for the same. Please provide your valuable feedback. Attached are the images for the same. Its SAC305 alloy , R0L1 flux chemistry. Regards, Am
Electronics Forum | Tue Dec 31 11:48:36 EST 2019 | emeto
Hello experts, I have a 50mmx50mm LGA on a PCBA. I Would like to decrease voiding in these joints and I wanted to hear about your techniques to decrease voiding. Stencil is currently 5mil. SAC305. ENIG finish.
Electronics Forum | Thu Apr 15 19:58:40 EDT 2021 | jimpat
In addition to confirming that the pad temperatures reach above the melting point of the preforms, consider checking the O2 PPM concentration.
Electronics Forum | Tue Apr 27 07:46:14 EDT 2021 | jeremy_leaf
I have tried cleaning the pads. That was our first step. Ultrasonic cleaning in acetone and IPA, and also tried etching in a 10% HCL solution. Our board is definitely achieving the correct temperature.
Electronics Forum | Tue Apr 27 07:50:09 EDT 2021 | jeremy_leaf
@KWalker I think that could be the case. Though I read somewhere a while back that nickel oxidation can be quite tough to remove, even with flux. Am I wrong about that?
