Electronics Forum | Thu May 14 13:25:14 EDT 2009 | cyber_wolf
Me thinks generic profile + desktop and laptop computer boards= not happy time. Attach thermo-couple to appropriate location on said part/pcb. Make profile same as solder manufacturer / component manufacturer spec. There is no magic heater set poin
Electronics Forum | Fri Jun 19 07:50:26 EDT 2009 | stepheniii
I worked for a company that had an industrial nurse come in to discusss lead with us. Short version; "There is nothing in the plant that will even come close to vapourizing lead" and "don't eat it". She said it's normal for everyone to ingest some
Electronics Forum | Mon Aug 24 11:17:19 EDT 2009 | stepheniii
Don't make that assumption. Once we had concerns about PCB's not matching what was ordered. I said "if we got HASL instead of ENIG, how do we know we got lead-free?" I mean if one thing got mixed up in translation, maybe two did. So we put a bare P
Electronics Forum | Thu Oct 15 16:11:50 EDT 2009 | rrpowers
We've been using Vi machines for 6 years now and love them. For us they have been quick to program, good at optimizing, and excellent at low false fail rates. The vision tools also gave us more accurate component data. We had problems with high fa
Electronics Forum | Thu Oct 29 08:12:47 EDT 2009 | jrockwell
For low volume and larger sized parts, as you stated, I would go with a GSM. There are plenty on the used market at fair prices. But as Sr. Tech said buying a used machine is tricky. Having a technician or engineer who is very familiar with the machi
Electronics Forum | Thu Nov 05 16:56:38 EST 2009 | lynn_norman
In a previous job, we had torque off requirements for different sized components for our screen print adhesive (non-conductive in our case). We used a torque watch that would measure max torque, so we could test production boards, shear testing was
Electronics Forum | Wed Feb 10 08:55:14 EST 2010 | blnorman
X-ray is probably more useful in the grand scheme of things. SAM will, like Glenn said, pick up delams in components especially at internal interfaces. X-ray will only pick up a defect like this if it's perpendicular to the delam, very difficult.
Electronics Forum | Wed Mar 03 18:42:29 EST 2010 | 89jeong
Hello Graham Copper. Thanks for yr comment. I will review the pad size and component placement with our engineer. It looks that the placement of lead is wrong. But what i want to hear from you is about solder lump on the right.As you can see, the sol
Electronics Forum | Wed Mar 03 23:07:59 EST 2010 | davef
If your "engineer reviewed the reflow profile and said this was not related to reflow conditions," then what does he think it's related to? We think that a increased effort to improve the thermal recipe to solder this part is required, because: * S
Electronics Forum | Thu Mar 25 09:27:08 EDT 2010 | stepheniii
Thanks I guess I got used to google where the "and" is implied. I searched various combinations and all I could find were threads regarding the pcb's not the components. Does anyone bake their boards after wash before second reflow because of MSD c