Electronics Forum: sample size for process qualification (Page 1 of 1)

Re: MicroBGA qualification process

Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F

Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so

Books for SMT

Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef

DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b

Re: X-Ray for CSP devices

Electronics Forum | Tue Jul 20 09:59:22 EDT 1999 | Vikram Butani

Hi Steve, What Earl says is true. You need a stand alone failure analysis/process verification system before you go inline. No matter what brand you choose, it is important to compare a few features, across the board: - X-ray source kV, mA, and f

Re: Mil 50884 Qualification for Flex/Rigid Flex - Help !

Electronics Forum | Wed Sep 30 10:38:42 EDT 1998 | Earl Moon

| Anyone have ideas how to get MIL 50884 Qualification?. | | We are a small/mid sized Flex, rigid-flex circuit shop in Canada considering MIL Qualification. Is there any web site that we could check out? | | any advice is appreciated. | thank

Any comments for Quality @ AQL=0.1, C=0 ???

Electronics Forum | Mon Mar 25 15:51:04 EST 2002 | davef

ASQC re-numbered the once free (taxpayer sponsored development) MIL-STD-105 as ASQ-Z1.4, slapped their own cover on it, and now charge $40 or $50 for the same document! The standards are identical, so see if you can get one of the old �MIL-STD's� and

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n


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