Electronics Forum | Mon Nov 20 04:04:42 EST 2000 | Gyver
Sirs, Please do me a favor to answer the following questions, thanks a million! 1. Will the baking of BGA or PCB cause more oxidation before the SMT process? 2. What is the acceptable Life Time of solderability at customer site? The time that the sol
Electronics Forum | Fri Apr 20 07:30:14 EDT 2001 | wbu
In short: the measured deviation / the length this deviation occurs * 100% = % of deviation Actually we encounter mostly "twist" so we put the board on a flat surface, hold it down at the corners to see if any of the corners lifts, measure the heig
Electronics Forum | Mon Apr 23 14:03:18 EDT 2001 | Ryan Jennens
Dougie- We,too, have the IPC-A-600F, and the spec. refers to IPC-TM-650 test method in the back of the book. Look on page Number 2.4.22 of the test methods appendix. This outlines the procedure for determining the percentage of bow and twist,
Electronics Forum | Wed Nov 07 15:01:18 EST 2012 | nikyta
Thanks Dave , my question is about Spopov want to try "Lead Free" SnBi (but uses it on Leaded finishes), but is worry about its low melting point (at this point, no longer 138 degrees as he wrote, but rather in an unknown and unpredictable range bet
Electronics Forum | Thu Oct 17 05:16:44 EDT 2013 | vincentdesilva2003
Anyone can help me how many percentage of blowholes and pinholes if i do the followings: 1. Increase copper plating thickness more than 25 microns. 2. Pre Baking of PCB to remove gassing by drying out the PCB's
Electronics Forum | Thu Dec 07 10:16:31 EST 2006 | James
Shocked ! Are you kidding. As a percentage of all of Siemens revenue you've got to get out the microscope to find what the pick and place machines are bringing in, not to mention profit margin. I would bet its the dog of the whole corporation.
Electronics Forum | Thu Jul 03 08:53:27 EDT 2008 | rgduval
I would...and then use the data of the known issues as part of the secondary analysis. The defect is a defect, one way or the other. You can use the secondary analysis of your PPM numbers to continue to drill down in the process. If your overall P
Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F
Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,
Electronics Forum | Tue Jun 09 07:35:23 EDT 1998 | Steve Gregory
Hi there Gary, Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly. W
Electronics Forum | Tue Jun 09 15:46:29 EDT 1998 | Aric Parr
| Hi there Gary, | Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly
