New SMT Equipment: scientifice and test and 5,000 (2)

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

Panasonic CM202 used smt PCB pick and place machine

New Equipment | Pick & Place

=1.0 ±50/Chip Cpk>=1.0 ±35/QFP Cpk>=1.0 ±50/Chip Cpk >=1.0 ±35/QFP Cpk >=1.0 Productive Highest Tact (CPH/sec) 25,000/0.144 19,000/0.189 7,200/0.5

Langke Automation Equipment(smdmachine.com)

Industry News: scientifice and test and 5,000 (16)

IPC and ITI to Host Conference on Critical and Emerging Environmental Product Requirements

Industry News | 2019-05-05 19:06:43.0

IPC – Association Connecting Electronics Industries® and the Information Technology Industry Council (ITI) will host a conference series on “Critical and Emerging Environmental Product Requirements” in Boston, the Chicago area and San Jose on June 3, 5, and 7, respectively. The series will feature well-known United Kingdom (UK) regulators Carl Magness, product safety enforcement team leader, and Paul Tennant, product safety enforcement manager, both within the UK Office of Business, Energy and Industrial Strategy (BEIS), and Giuseppina Luvara, a policy officer within the European Commission’s Directorate General of Environment.

Association Connecting Electronics Industries (IPC)

IPC Welcomes New Director of EHS Policy and Research

Industry News | 2019-04-14 19:12:08.0

IPC -- Association Connecting Electronics Industries® announces the addition of Kelly Scanlon, DrPH, CIH, as director of environment, health & safety (EHS) policy and research to its staff at IPC’s offices in Washington, D.C.

Association Connecting Electronics Industries (IPC)

Technical Library: scientifice and test and 5,000 (5)

Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers

Technical Library | 2012-10-11 19:50:09.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper shows the benefits by using a pure palladium Layer in the ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) and ENEP (Electroless Nickel, Electroless P

Atotech

Leaded and Lead-Free Solder Paste Evaluation Screening Procedure

Technical Library | 2010-05-12 16:21:05.0

Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder paste and the printing process. Reflowing adds another 15% or so. In light of this fact, it is surprising that no simplified procedure for solder paste evaluation has been documented. This paper is about such a procedure.

Indium Corporation

Express Newsletter: scientifice and test and 5,000 (758)

Partner Websites: scientifice and test and 5,000 (71)

DFN 3 & 4-Pin Numbering and JEDEC MO-236C Standard - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/dfn-3-4pin-numbering-and-jedec-mo236c-standard_topic1368_post5458.html

www.pcblibraries.com/pod Once we created an FPX file with every JEDEC component family and their dimensions. Then we downloaded 5,000 component manufacturer's datasheets and entered all those component dimensions

PCB Libraries, Inc.


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