Electronics Forum: screen printing (Page 81 of 89)

Solder at gold finger

Electronics Forum | Mon Feb 05 20:43:27 EST 2001 | davef

1 Solder on gold fingers comes from: 1a About 70 % of the time it's caused by poor cleaning of screen printer, staging area (table), conveyor, reflow oven chain or belt, and keeping boards separate from cleaning process 1b After loading paste onto

Solder on Gold Fingers?

Electronics Forum | Sat Mar 14 09:12:59 EDT 2009 | davef

First, there is no good justification for getting solder on gold fingers. Second, it is well known that solder on gold fingers is unacceptable. So, shipping boards with that condition indicates sloppy quality practices at your CM. Third, that being

What will be the effect of additional solder paste?

Electronics Forum | Tue Apr 19 16:20:05 EDT 2016 | davef

Don't blame it on the poor paste thickness requirement [although I might go on to argue that it's could be a contributor to the issue]. Most likely you're the problem. About 70% of the time solder on gold fingers is caused by poor cleaning of screen

Flex Circuits reflowing

Electronics Forum | Fri May 02 16:58:39 EDT 2003 | swagner

We have been building with flex circuits for nearly three years now, its an automotive product utilizing lead free paste, I will give you a few pointers. 1. Evaluate your supplier carefully, make sure you have some kind of stretch tolerance on the p

Re: BGA PAd Soldermask

Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F

Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad

Re: BGA PAd Soldermask

Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F

Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad

Micro BGA pads, adhesion to laminate

Electronics Forum | Thu Jul 10 09:55:47 EDT 2003 | davef

A reading of the pictures is: A1: Looks like pad [B1] is smaller than the other pads. It�s weird that the pads are such different colors. A2: Looks like pad [B1] is smaller than the other pads. Solder mask opening [B1] is misregistered and seems s

Question to DEK users

Electronics Forum | Fri Oct 26 11:29:41 EDT 2001 | kaopsahl

I have two DEK 288s set up in our shop, we used to use a Fuji GSP_III. I could not possibly say enough good things about the DEKs - they are incredible. The only real complaint I have with them is that if an error pops up that locks up the software -

Cleaning SMD Adhesives

Electronics Forum | Wed Oct 30 10:55:53 EST 2002 | ahobby

I hope you'll take an answer from the sunny UK. I don't usually read these forums but contribute to similar over here, hence the late response. We have an Invicta Sabre 757 machine in our Demo room, running with Zestron SD 300. We give the PumpPrint

Printing SPC

Electronics Forum | Fri Sep 06 11:58:21 EDT 2002 | Brian W.

The most effective method is to monitor both printing results and parameters. Periodically (maybe once per month), run QCCalc or another program to measure the machine's capability to hold its set parameters. I also run control charts on the paste h


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