Electronics Forum: screen and printing and aspect and ratio (Page 1 of 1)

Volume and average height of solder paste after printing machine

Electronics Forum | Thu Oct 02 17:00:44 EDT 2008 | davef

Is that accurate? If so, what are your aspect & area ratios? [Similar to the JerryS comment above.] * You say, � � and the average height is very high: nearly 200 pct.� => Our troop can make paste that height too. They snap the stencil-off a fast as

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Fri Jul 16 03:11:23 EDT 1999 | SPEZZAFERRI Luca

| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec

CCGA and overprinting?

Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef

On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Wed Mar 24 23:12:48 EDT 2021 | grahamcooper22

0.66 area aspect ratio...so for example...if the device is 0.5mm pitch QFP, the pcb pad may be 12 thou wide..make the aperture 9 to 10 thou wide...and reduce it's length by 10 % overall compared to the pcb pad.... Depending on device pitch, select ap

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