Electronics Forum: screwy (Page 1 of 1)

Connector solderability

Electronics Forum | Wed Nov 06 10:31:30 EST 2002 | davef

First, from what you say, it's unclear that there is a "solderability" issue with your connectors. Different appearance of the soldered connection from one side of the connector to the other is what we're talking about [I think]. But it is curious.

Plated through via's in pads.

Electronics Forum | Thu Feb 06 14:47:50 EST 2003 | MA/NY DDave

Hi "some customers/designers want to have via holes to be present in the PCB pad, due to some belief that it helps in heat dissipation. " As I think about this I don't know exactly why they would be concerned. I can imagine in some exotic products

Re: Immersion Gold

Electronics Forum | Thu Sep 30 13:37:08 EDT 1999 | Dave F

| | I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | | What is the best way to

Re: Reflow Oven Evaluation Using Cpk

Electronics Forum | Thu Mar 19 11:44:00 EST 1998 | Earl Moon

| | Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | | 1. C

Help or nothing!?

Electronics Forum | Thu Jun 22 09:09:36 EDT 2006 | Chunks

Hi Evtimov, You need to call your manufacturer! Just joking! Sorry, but it is a "forum", which means you need to pick and choose your information carefully. Some are rookies that may give a simple or silly answer without knowing, some are seasone

BGA attach eval.

Electronics Forum | Thu Apr 03 11:57:38 EST 2003 | davef

R4: We see the ball left on the PCB with a flat top and the BGA pad appears to be virgin. D4: Not good. The flat top indicates that the ball melted at one time or another. This pad and ball have seen at least two solder cycles with solder and flux. S

Re: Immersion Gold

Electronics Forum | Fri Oct 01 05:03:28 EDT 1999 | Wolfgang Busko

| | | I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | | | What is the best way

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