Electronics Forum | Tue Mar 10 04:37:44 EDT 2020 | luciano_zhang
I have a files need produce in a urgent time. It's 4 layers PCB with 3 OZ inner and out layer quantity need 10000pcs ,any one know which supplier is aviliable?
Electronics Forum | Thu Mar 12 08:38:47 EDT 2020 | floravictor
Hi, We can produce such pcb, we are pcb factory in Shenzhen. my skype: qjthomasxiao mail: victor@flora-ltd.com
Electronics Forum | Fri Jun 12 09:10:48 EDT 2020 | apcpcba
Hello, we can meet your request, welcome to visit our website: https://www.apc-pcbassembly.com/
Electronics Forum | Thu Jun 11 09:28:57 EDT 2020 | pcbkathay
Dear Luciano, We are PCB manufactured based in China,we can produce the PCB as your requirements as soon as we can, please send the files to my email 284816044@qq.com looking foward to your email.
Electronics Forum | Thu Jun 11 02:32:54 EDT 2020 | beanzheng0
Hi, Luciano This is James from http://www.nextpcb.com We can do your order we have 2 manufacturers over 2500000sq. The 4 layer PCB boards on sale now. Please send your inquiry to support@nextpcb.com Or you can contact me on WhatsApp:+8613243830029 S
Electronics Forum | Mon Nov 07 16:34:55 EST 2005 | CW
If I am putting chip capacitors on a .063 FR4 board, what size package should we stay away from to avoid cracking? If I use 2 mil copper on the outside layers of a PCB, am I limited to what pitch of parts I can use? Specifically, will using 0603
Electronics Forum | Mon Nov 07 16:31:47 EST 2005 | CW
hi Bob, Thanks for the info. I understand your comments, but I am looking for specific guidance, If I am putting chip capacitors on a .063 FR4 board, what size package should we stay away from to avoid cracking? (I realize this is dependent on h
Electronics Forum | Mon Nov 07 12:25:32 EST 2005 | Rob
Hi CW, Larger chip caps can be susceptable to cracking, but mainly this is due to handling - flexing of boards is the main culprit (the part being mechanically joined at both ends to the board). PCB's usually flex easiest along one axis, and larger
Electronics Forum | Tue Nov 08 05:00:23 EST 2005 | rlackey
Hi CW, Regarding orientation, yes, your diagram is right - see the following link for confirmation. http://search.murata.co.jp/Ceramy/image/img/A18X/C2EB3C.PDF Regarding information on bending strength you want to talk to your local Murata office
Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef
Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder
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