Electronics Forum: sec (Page 1 of 59)

Solder balls

Electronics Forum | Tue Jul 20 02:36:03 EDT 2004 | yukim

Hi, The solder paste is SE5-M951X-9. Comparing with the previous one we used, we are having much more tombstoning problems. The reflow profile is such as: room temp to 140C: 85~95 sec 140 to 170 C: 80 sec 170 to 200 C: 20 ~ 23 sec Above 200 C: 44 ~

blowholes in SMT process

Electronics Forum | Fri Mar 20 05:07:16 EDT 2009 | rocko

Hi All, I was puzzled because of terrible blowholes in solder joints of gold plated odd-form components. I am very confused because all other components on the boards have perfect solder joints. Here are some process details: 1) Solder paste: N

Palladium poor wetting

Electronics Forum | Tue May 23 21:14:22 EDT 2006 | davef

First, where the temperatures that aare mentioned in the original post measured? Second, it sounds like the PdAg component terminations are not seeing enough heat [your soldering iron touch-up proves this]. Your 232*C peak is the absolute minimum s

Re: seeking low cost fix to tce mismatch

Electronics Forum | Wed Dec 29 15:42:34 EST 1999 | Mike Naddra

Justin, I would be currious as to your customers application, and if the temperature delta and rate are great enough to cause solder joint failures as a function of mismatched Tce then you may want to consider that even if you are able to identify

Squeegee speed for Sn/Pb

Electronics Forum | Thu Sep 15 16:35:08 EDT 2005 | slthomas

I wouldn't expect them to define squeegee speeds any more than they would tell me which printer, squeegee blade, or surface metallization to use. Start at 1"/sec. and see what it looks like. Try 2"/sec and .5"/sec. and see if they're any worse or b

Asahi Viromet Lead Free Paste

Electronics Forum | Thu Mar 01 17:56:18 EST 2007 | darby

Tested recently on ENIG finish. profile as follows 100-150, 57 sec. 150 210, 46 sec. 210 + , 63 sec. Peak 231. This profile was developed for this paste as per Asahi literature. Operator said it "looked wet and smelled good"! Print quality was excel

Reflow profile negative temp ramp rates

Electronics Forum | Tue Apr 09 00:09:25 EDT 2002 | craigj

Question. When profiling and looking at the profiles cooling rate. Over what temperature range should the slope be monitored and what sort of cooling rates should be looked for. Paste supplier says no more than 6degC per sec, some components maybe lo

Intrusive reflow component selection

Electronics Forum | Mon Jul 10 09:23:47 EDT 2006 | Rob

Hi Dougs, Info as follows: TAICOM TSD42: Matte Tin, 240C for 5 secs TAICOM TSD08: Matte Tin, 225/3 secs (I wouldn't!) TAICOM TKB06MSL: Matte Tin 260/40 secs (TBC) HARTING 09232486824: Harting don't supply. TAICOM TI40BHS: Matte Tin, 225/3 secs (I

IC short

Electronics Forum | Mon Jan 29 14:10:19 EST 2007 | tonang

We use M/C printer Samsung SP400V with M/C setting : - Auto Cleaning time 15 ea - SQG down lenght (mm); Front 0.5 Rear 0.5 - SQG Presure Front 0.5 KG, Rear 0.5 Kg - Print speed Front 30 mm/sec, rear 30 mm/sec M/C reflow Heller 1707 EXL, with setting

what is the max print speed? thanks for your help

Electronics Forum | Mon Nov 05 13:33:08 EST 2007 | slthomas

Heck no, I mean we print relatively slower on complex boards, as in 1 inch/sec (25.4mm/sec), and maybe 2 inches/sec. (51mm/sec) on less complex boards. SMT is not a bottleneck in our plant and printing never the bottleneck in SMT, so I see no need t

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