Electronics Forum | Mon Dec 31 08:11:23 EST 2001 | hany_khoga
Dear all : We are suffering a severe curvature in our boards when coming out of the wave solder m/c. An Engineer suggested to enter them again for a second pass in the m/c expecting board were thermally mistreated just after the W.S. Can this real
Electronics Forum | Mon Dec 31 08:59:36 EST 2001 | Don Adams
The second pass in the wave is pretty extreme and will probably aggravate the conditions which caused warpage in the first place. Areas to look for problems, The lay up of the boards at fabrication or the materials used can lead to warpage. Work wi
Electronics Forum | Tue Feb 11 07:35:03 EST 2020 | dontfeedphils
If all else fails, you can always chipbond the part. Would it be possible to run this side as the second reflow?
Electronics Forum | Wed Feb 12 07:25:47 EST 2020 | dontfeedphils
If you have control of the solder alloy you're able to use on the product, you could run a lower temp solder on the second side and try to avoid the first side entering reflow.
Electronics Forum | Wed Feb 12 10:11:05 EST 2020 | emeto
Would you consider a light reflow pallet on second side holding the connetors in place and preventing them from moving?
Electronics Forum | Wed Feb 12 10:17:15 EST 2020 | emeto
Would you consider a light reflow pallet on second side holding the connectors in place and preventing them from moving?
Electronics Forum | Thu Mar 25 09:27:08 EDT 2010 | stepheniii
Thanks I guess I got used to google where the "and" is implied. I searched various combinations and all I could find were threads regarding the pcb's not the components. Does anyone bake their boards after wash before second reflow because of MSD c
Electronics Forum | Wed Mar 24 17:09:34 EDT 2010 | davef
RE Search: Search can be tricky. Try MSD and wash
Electronics Forum | Mon Feb 24 01:40:05 EST 2020 | sarason
Traditionally these connectors are riveted to the board on higher volume telecommunication applications. sarason
Electronics Forum | Mon Jun 21 08:01:38 EDT 2010 | jm
Hello, need some help if anyone has any insight on this issue. Ran first side and ex-ray indicates BGA parts look normal. Ran the second side and now the BGA balls on first side appear to have broken free and moved under part. This board has BGA's