Electronics Forum | Mon Jan 07 13:09:35 EST 2008 | stevek
As I told you, some carriers (trays) are limited > to 75 degree maximum, and from time to time > employees do not pay attention to this. This is > one of the reasons. The second reason is that 90 > degree still be problematic in a case of rebake
Electronics Forum | Tue May 13 08:26:29 EDT 2008 | davef
First, on your reflow temperature comment: The 183*C focus for reflow recipes for tin-lead solder is a falicy. If you held a recipe for tin-lead solder at 183*C peak, it would never reflow. Recipes for tin-lead solder need to be at liquidus plus 20*C
Electronics Forum | Fri May 23 18:55:20 EDT 2008 | gregoryyork
This is one of the biggest mistakes with the Lead Free process. We have all listened to the 'industry experts' and followed their advice and unfortunately got it wrong. Keep the dwell times (dependant on alloy selection) the same as Leaded so you are
Electronics Forum | Mon Jul 14 13:45:17 EDT 2008 | ck_the_flip
Patrick... Contact LENGTH as in inches, mm, or cm...not time..is decreased with a slower belt speed. The slower the speed, the less contact LENGTH with the wave per unit time ...whereas at a faster speed, your leads are contacting more solder, th
Electronics Forum | Tue Jul 15 16:12:23 EDT 2008 | boardhouse
Hi Armynski, I sell for an offshore board house, yes, it is common for offshore board shops to fill vias. The bubble is caused by air entrampment within the hole it self, when heat is applied during Hot air and the via is covered on both sides the e
Electronics Forum | Sat Mar 14 09:12:59 EDT 2009 | davef
First, there is no good justification for getting solder on gold fingers. Second, it is well known that solder on gold fingers is unacceptable. So, shipping boards with that condition indicates sloppy quality practices at your CM. Third, that being
Electronics Forum | Fri Nov 20 17:50:51 EST 2009 | bigalnz
Hi All, I do PC/Laptop repair and are finding some jobs I cant do because they need a BGA rework. I dont admit to being a pro with respect to BGA, and thus a purchase decision is hard.I have been looking at : http://zhuomao.en.alibaba.com/product/
Electronics Forum | Mon Jan 18 10:49:22 EST 2010 | pcbrookie
Hello all, One of our resistor arrays is becoming detached from its balls after reflow. This is the second instance of this happening. The balls are clearly soldered to the board, but the actual package is coming off (package pads are quite bare).
Electronics Forum | Fri May 07 15:23:24 EDT 2010 | hegemon
We are evaluating Vapor Phase right now, and there is something that bothers me a bit. The machine has a preheating stage where we can bring the board, components and paste up to temp to dry the paste out before descending into the Vapor. The heatin
Electronics Forum | Wed Apr 11 00:40:19 EDT 2012 | ngineer
I have a problem setting up the LAE on my Quad 4c. I set it up for 0805, and it seems to work, although it rejects a lot of parts, at least it places "most" of them. I tried setting up on a soic14, and could not get even one to pass. I believe I h