Electronics Forum: see (Page 466 of 725)

Re: Why so little interest in Bulk Fed passives?

Electronics Forum | Wed Jan 06 23:59:37 EST 1999 | Andy

| | If passive componets are cheaper why aren't they more popular? Manufacturers like Murata and AVX claim availability and substantial cost savings but little interest seems to exist. Why? Your input is greatly appreciated. | | | Because people ju

Re: Solder Balling

Electronics Forum | Tue Dec 29 04:27:08 EST 1998 | John W

| I have an inbteresting problem on my N2 wave soldering lines. | We have two N2 wave soldering line. Line A is old one and Line B is new. | We found solder balling Phenomenon on PCB After soldering in the new N2 Atmosphere Wave Soldering Machine. In

Re:X Y Correction at High Speed at +/- .002

Electronics Forum | Mon Dec 28 12:34:50 EST 1998 | Jon Medernach

Inorder to pick up 0402's RELIABLY correction is required in X & Y axis. Their are Chip Shooter that do this, (KME Create, and Sanyo) You can also place at +/- .002" at 43K cph with a Chip Shooter Bulk feeding is also desirable. It is not only the

Re: Conductive Epoxy

Electronics Forum | Fri Dec 04 19:17:03 EST 1998 | Jason

Jeff, I used conductive epoxy for diebonding and chipcaps on hybrid xtal controlled osc. We were applying via stencil printer, then curing in a KME vertical cure, a real foot print saver. Even under controlled environmental conditions, it was a re

Re: Conductive Epoxy

Electronics Forum | Mon Dec 07 09:22:50 EST 1998 | rick

| Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. | Any in

Re: Help-Wire Bonding Defects Analysis After Encapsulation

Electronics Forum | Fri Nov 27 08:07:50 EST 1998 | Earl Moon

| | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is

Re: polyimide stencils

Electronics Forum | Thu Nov 12 20:57:04 EST 1998 | Dave F

| | I keep hearing about polyimide stencils, but what are they like in terms of registration and aperture accuracy? | | | Fraser- | | We use polyimide stencils with great success for our prototype boards. They are cheaper and the accuracy/aper

Re: polyimide stencils

Electronics Forum | Sat Nov 14 08:58:38 EST 1998 | Earl Moon

| I keep hearing about polyimide stencils, but what are they like in terms of registration and aperture accuracy? | You are hearing about polyimide as in polyimide film as Kapton (TM Dupont). This material is the stuff of flex and rigid/flex circuit

Re: Wavesolder solder balls

Electronics Forum | Sat Oct 31 10:56:16 EST 1998 | Dennis Barry

| I finally got my problem figured out on the bridging, the | only thing I'm finding is that I notice some litlte solder balls on the bottom of the board. Is that normal? Is that why I'm getting bridges? Has anyone came across this problem and pass t

Re: QUAD / MYDATA / CONTACT SYSTEMS

Electronics Forum | Fri Oct 30 14:24:50 EST 1998 | Greg Curler

| Does anyone have info on any of these systems (good or bad). We are looking at these 3 types for a new SMT pnp machine. We are low volume high mix. | | Thanks, Dave | Dave, We bought a new machine this year, and like you, narrowed the field o


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