Electronics Forum | Tue Nov 05 16:41:53 EST 2002 | Ray M
This one's got me stumped, so I thought I'd throw it out for discussion: I have a 20 pin SMT ribbon connector by Molex that I've been using for about a year without problem, but recently things aren't looking so good. The solder is pulled up off of
Electronics Forum | Wed Nov 06 10:31:30 EST 2002 | davef
First, from what you say, it's unclear that there is a "solderability" issue with your connectors. Different appearance of the soldered connection from one side of the connector to the other is what we're talking about [I think]. But it is curious.
Electronics Forum | Wed Nov 06 20:18:30 EST 2002 | davef
cvrgrrrl Your first thermal cycle with imm silver should be the easiest to solder. That you see copper indicates you did no soldering, got no wetting, produced no intermetallics, etc. Tell us again which components did not solder? Wuzzis "plug" t
Electronics Forum | Wed Nov 06 16:31:59 EST 2002 | slthomas
I would also consider paste control (don't take it personally...I always have to get after people about this one), time on the stencil, time between print and reflow, solderability of the component leads, paste volume (that one really got us once....
Electronics Forum | Wed Nov 20 16:53:18 EST 2002 | davef
Q1: How important is the bare PCB baking ? A1: Baking boards is a non-value added activity. Q2: What is the temperature for baking @ what RH ? A2: Search the fine SMTnet Arcives for bake recipes. Q3: What would be the impact for the ENTEK finishe
Electronics Forum | Fri May 09 17:47:37 EDT 2003 | slthomas
I think medical manufacturers are more inclined to proceed with caution because they have so much more at stake when something fails out of the box, or worse yet during a code. A lot of them locally have gone outside for pcb assembly, but stayed dom
Electronics Forum | Fri Nov 22 10:18:33 EST 2002 | Joaquin Rodenas
Dear Mr. Liang I'm a service ingeneer in a distributor of FUJI products. My first suggestion is get some help from the FUJI dealer in your territory, but anyway try the following: First of all, check again the FTP tool included in F4G-main windows
Electronics Forum | Mon Nov 25 09:06:15 EST 2002 | jax
You might want to check the tin thickness. I believe you have a minimum of .65 microns in order to achieve a good solder joint through 3 thermal passes. In an immersion tin process, the ability to solder is time and temperature dependant. As the int
Electronics Forum | Tue Dec 03 13:35:22 EST 2002 | wpease
Hi Brad, Before I tell you my glove fits your hand, I'd like to see your hand. More specifically I'd like to learn more about your application. Board size range? Component size range? Finest pitch? Degree of warpage? Two-sided? etc. Contact m
Electronics Forum | Mon Dec 02 12:52:40 EST 2002 | slthomas
We're trying a selective soldering pallet for the first time with mixed reviews. Are solder balls a prevalent problem with this process? Most of them seem to correspond with pallet wall locations....is it too much turbulence from the rotary chip wav
