Electronics Forum | Fri Mar 16 01:26:31 EDT 2007 | CHITRA K
Many thanks for your reply. We would like to clarify two things; 1. We have recently purchased a vision system with oblique viewing facility to rotate the camera with 40x magnification, which we find useful to inspect fine pitch components . 2. Wh
Electronics Forum | Thu Apr 05 23:27:37 EDT 2007 | mika
to pad on the PCB. The pick & placement as I mentioned before is OK. Now our X-Ray machine cannot see if the joint is firm whitin the PCB-pad and the LGA-pad. So I still don't know if this "gonna work" in a long term...The customers of ours doesn't
Electronics Forum | Thu Mar 29 08:46:23 EDT 2007 | realchunks
Well I DO KNOW! Hi aj, 100% on the lead pads and 50% reduction on the center pad if you do not use thermal vias. If you do use thermal vias, you may need to increase the amount of paste needed, but not by much. 50% will be a good start. After re
Electronics Forum | Mon Apr 02 09:57:19 EDT 2007 | ed_faranda
Yes, Hand Up here. I would think you would have a quality problem. I am assuming you're doing this process in some sort of batch mode. I would hope that you can process your boards within a few minutes after components being placed. Things that I
Electronics Forum | Tue Apr 03 05:46:35 EDT 2007 | chrissieneale
OK - going to set up some measurements so we can see how big this problem is. I've got the following so far... Number of boards pasted per employee per shift Number of hand placed parts per employee per shift Number of people per shift Time pasting
Electronics Forum | Wed Apr 04 19:10:20 EDT 2007 | rgduval
Pete, Top-side temp might be an issue. What's the easiest way to check it? I seem to recall some thermal decals that we used to use a couple of jobs ago. I spoke with the flex manufacturer, and they recommended 4 hours at 250 degrees pre-process
Electronics Forum | Thu Apr 19 16:54:32 EDT 2007 | flipit
I don't suggest using Pd/Ag or Ag/Pd terminated components unless you are forced to use them. You often see a line of demarcation that suggests a poorly wetted solder joint. I have had bad experiences with Pd/Ag terminated capacitors. Even when so
Electronics Forum | Wed Apr 18 09:16:51 EDT 2007 | Cecil
We currently have an assembly that we have to mask the surface of several (24)SMT components where thermal compound is applied at a latter operation. These component packages vary from BGA's to QFP's. After the thermal compound is applied the PWA is
Electronics Forum | Mon Apr 23 15:44:31 EDT 2007 | flipit
Steve, You read it the same way I read it. Some of my coworkers thought that the 600 micron and under spec meant that you could use lead solder and be exempt at this component pitch. That is why I posted it on SMTNET. The exemption specifically s
Electronics Forum | Tue Apr 24 09:51:18 EDT 2007 | slthomas
Patrick, firstly, I don't disagree with you on the efficacy of or lack of good science behind RoHS. It's a bad joke and our industry is the victim that got punked. I simply don't see anywhere in that document that states they've got an exemption tha
