Electronics Forum | Thu Dec 02 10:32:47 EST 1999 | Boca
Curtis, They have a 'permalex' coating bonded to the metal. We see no signs of flaking. They are pricey but they do work, we had metal blades from the OEM, they were absolute trash (not MPM). We run 16-6 and they last at least 4 to six months in
Electronics Forum | Fri Nov 12 16:27:43 EST 1999 | Michael Allen
The papers I've read suggest that we need to be concerned if the weight percent of gold in the finished joint exceeds 3%. You might want to do the calculations to see where you stand, before you set up a process to "tin" the leads. If you find that
Electronics Forum | Wed Nov 10 12:13:53 EST 1999 | Wolfgang Busko
That�s what we consider to be practical if the 20% were the worst case we see but the reality looks different. By chance we get a -20%, sometimes worse, sometimes a "good" 10%, rarely does it hit the nominal value and never it�s a +%. In short: It lo
Electronics Forum | Thu Nov 04 07:53:45 EST 1999 | Chad Notebaert
Sounds like you have a component problem! I say this because you say the sodler is flowing away from the components (leads I assume) This sounds like none wetting of the component. Do a solderability test on the parts. Take the parts and dip the lead
Electronics Forum | Mon Nov 01 17:13:37 EST 1999 | Mark W.
Jason, What is the revision of IPC you are referring too?? IPC 610 rev. b requires 75% fill on classes 2 & 3. Class 2 does allow the exception of 50% fill if the PCB has a Metal Core or Thermal/Heatsink Plane provided that the solder extends 360 de
Electronics Forum | Tue Oct 26 08:17:54 EDT 1999 | William
Dave, Last question(s). What do I do about a gold porosity problem? Dave: How would I approach the board house to check for this? They use a very well known chemistry, but is that where the pblm lies? Or would it be in their process, cycle times
Electronics Forum | Fri Oct 22 21:23:59 EDT 1999 | se
Tombstoning is usually oven profiling, see October 14 thread below. Aperture rules are misleading. Component mix, stencil thickness, paste factors, all contribute. Also, are you making the stencil from a paste or pad layer or from a soldermask layer?
Electronics Forum | Thu Oct 14 20:42:07 EDT 1999 | Jeff Ferry
Grace, As deifned in IPC 7721 Procedure 3.2 Bow and Twist Repair "Bow and twist after soldering shall not exceed 1.5% for through hole PC boards and .75% for surface mount PC boards. The bow and twist shall not be sufficient to cause difficulties d
Electronics Forum | Thu Oct 14 04:12:32 EDT 1999 | Paul Gerits
Hi Jim, I'm a Technical consultant/Application specialist at Philips EMT. Tombstoning is a well know problem with Nitrogen ovens. Proberly there has been a change in your Nitrogen flow or in the nitrogen it self. To see if there was a change run a
Electronics Forum | Mon Oct 18 08:27:54 EDT 1999 | Bruce
buy a MCS-30, which you will use only to transmit programs to machines." If your really looking for the right software, contact Fuji about their latest software labeled FujiCam (Unicam). I don't think you can buy F4G software anyway. I guess it all d
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