Electronics Forum | Thu Jan 04 17:04:43 EST 2007 | slthomas
99% good solder joints = 10000 ppm (defects per million opportunities). Having only built with 0603s I can't speak for a target but that still seems pretty harsh....with a 75/25 0805/0603 ratio at my last place of employment I think we were running
Electronics Forum | Wed Jan 03 18:49:57 EST 2007 | Ben_T
Good evening all. I'm looking for information regarding how to generate Universal GSM placement programs. Basically, what I need to know is the format in which the machine will/can take in the placement data. There are a few GSM's where I work, but
Electronics Forum | Thu Jan 11 00:52:12 EST 2007 | behrsam
Mario, I tried a couple of profiles. In all cases the preheat ramps fairly slow, while the reflow utilizes the radiative heater to speed to reflow as quick as possible. I tried a quick profile and a slower one. The quick has about 15-20 sec at pre
Electronics Forum | Mon Jan 15 06:18:50 EST 2007 | CL
Good Morning Stephen, 1) Most solder paste manufacturers recommend a 2 hour temperature stabilazation period. Solder paste should not be opened and exposed to ambient air if it is still cold. 2)Manufacturers do not reccomend mixing old and new paste
Electronics Forum | Sun Jan 14 16:35:48 EST 2007 | Austin
I have several boards built at various CM's. We have prototype builds with some JTAG failures on BGA's (1-3 failures with qty 3, 1500 pin BGA's). CM's always claim reflow profiles look good. X-ray does not show bridges and they claim it looks good, b
Electronics Forum | Tue Jan 23 10:22:27 EST 2007 | Peter W.
Hello, maybe you are experiencing the so called "head in pillow" defect. It is especially critical for larger BGA. The defect comes from the deformation during reflow of the BGA, so that some of the balls are lifted and have no contact during liquid
Electronics Forum | Sun Jan 28 13:26:27 EST 2007 | Sweet Old Bob
Okay you CM haters I don't see anything about the design of the board, other than OSP which is strike one. What is the board size? What is the board thickness? Where is the BGA located on the board? What is your ball to pad ratio? What is your aspect
Electronics Forum | Wed Jan 17 09:32:09 EST 2007 | Jeff
Hi, I am having problems reworking a lead free PBGA (23mm x 23mm, 1mm pitch). The board is relatively small (5" X 4" X 0.063"). During the removal stage, a thermocouple was placed at the solder ball level (between the board and underneath of compo
Electronics Forum | Mon Jan 29 10:50:35 EST 2007 | mika
What about the component placement with Head #2? Head # 1 is ok? Is it only the pickup that is the problem and if so, from all feeder banks (front & Rear)? Concider Z-axis height adjustment, procedure is in the manual. You normally don't need to re-
Electronics Forum | Thu Feb 08 13:22:36 EST 2007 | smtstaff
SMTnet is looking for your input on a problem that has started to become serious... You may have noticed that the forum has had some spam posted... in the past serveral weeks in fact several hundred have been posted. We are soliciting your views a
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