Electronics Forum: selective and carbon and plating (Page 1 of 2)

COB and wire bond

Electronics Forum | Mon Jun 03 12:51:17 EDT 2002 | V.RAMANAND KINI

We are doing COB operations for nearly ten years. Pls. write to me if you need info on m/c selection, type of PCB, plating etc., Thanks V.RAMANAND KINI...03.06.02

Re: BGA and Gold Boards

Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon

Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. Mike Mike, We and ind

Printer and Reflow Oven Recommendations

Electronics Forum | Fri May 15 21:39:48 EDT 2015 | jlawson

Reflow.. 1.Rehm (Germany) - Best in Class Best overall process stability heating system ( Alot of makers have started to copy there VX heating arrangement ). COnveyor chains can be a bit more attention in terms of maintenance on rehm , but if foll

Selective soldering pallets and solder balls

Electronics Forum | Tue Dec 03 11:59:01 EST 2002 | slthomas

We haven't run a profile yet....probably because we're a-feared to. We can't do topside preheating here to any degree because we use an aluminum plate for aligning hundreds of top side through-hole components (pots, switches, buttons, LEDs) that te

Selective soldering pallets and solder balls

Electronics Forum | Mon Dec 02 18:01:12 EST 2002 | GSW

Hi, Try to check if there is water absorbed in the flux or the humidity around the wave area. possibly plating on barrels that might be damaged?

Selective soldering pallets and solder balls

Electronics Forum | Tue Dec 03 15:26:07 EST 2002 | GSW

This might be a trival mundane suggestion but try to use non conductive plate to hold components. Probably even made of the pallet material. I am sure your pallet fabricator will have tons of scrap and he can help you find one. T

Solder Ball and Splash after Hand Soldering

Electronics Forum | Fri Jul 24 07:43:56 EDT 2009 | davef

Your customer is correct. You are doing something wrong in your hand soldering process. Solder balls are a process indicator. Areas to assess are: * Moisture content of the bare board * Thickness of the copper plating in the through holes * Temperatu

Mixing No-clean and water soluble processes

Electronics Forum | Tue Feb 23 16:45:36 EST 2010 | dyoungquist

Davef is right on as usual. We are doing exactly what you do. Some smt with no clean paste then the plate through connectors on our selective solder machine using water soluble flux. We then clean with a ultrasonic water process. We do see the re

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 15:24:49 EST 2002 | mregalia

Thanks Chris. As I was writing my last message our mailperson dropped off the latest issue of Circuit Assembly. It has an article on mixing SMT and COB on the same board. The author recommends as a compromise 10-20 micro inches of gold over 70-100 of

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef

Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept

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