Electronics Forum | Sat Feb 22 11:37:00 EST 2020 | kylehunter
Hey all, I've made a post in the past about us expanding to a new space, but I wanted to do a new post with specific questions. We currently have a DEK 265, Phillips Opal Xii, and a Heller 1500. Our main reason for expanding is to have a lead-free
Electronics Forum | Tue Dec 03 11:59:01 EST 2002 | slthomas
We haven't run a profile yet....probably because we're a-feared to. We can't do topside preheating here to any degree because we use an aluminum plate for aligning hundreds of top side through-hole components (pots, switches, buttons, LEDs) that te
Electronics Forum | Mon Dec 02 17:02:28 EST 2002 | Vince Whipple
Steve, I agree with the recommendation to check the temperature. This is the first place to go. Is this an IPA or water based Noclean? What is the topside temp of the assembly at the effected areas? If you are too cold you will have a tendency to hav
Electronics Forum | Thu Dec 05 11:36:30 EST 2002 | William Guatemala
Have you check the flux gravity lately? If not, Check the flux gravity every 6 hours to make sure proper parameters are meet. Here is a list of things that may cause your solder ball problems; Excecive heat, defective fixtures, preheating temperature
Electronics Forum | Tue Dec 10 14:10:38 EST 2002 | Randy Villeneuve
Steve, I wave solder most if not all our boards with selective wave pallets. I did not catch if the solder balls were on top of the board or on the bottom but that will make a difference on what to do to get rid of them. Pallets are good and bad. On
Electronics Forum | Tue Jun 20 15:08:30 EDT 2017 | ranap121212
Hello I have the problem with selective soldering on the robot. Thin balls appear on the laminate. The tin sometimes shoots...? and then the balls are a few millimeters from the soldering point. I tried up or down with temperature, but it did not wor
Electronics Forum | Thu Jul 14 11:52:16 EDT 2005 | davef
Sure you can use SPC charting on the wave setup parameters to warn of impending problems. Examples of useful points of analysis are: * Dwell * Temperature * Pot analysis Certainly there's a range of other process controls that could be monitored.
Electronics Forum | Tue Aug 28 11:12:23 EDT 2007 | grics
This is what I was thinking, but I am being beat up pretty badly by the selective solder. Ambient temperature is anywhere in the the neighborhood of 76 - 80 degrees F. I am not sure of the RH, but I wouldn't think that would be my issue... One of
Electronics Forum | Wed Aug 23 14:59:32 EDT 2006 | bill
I�ve been lurking on the forum for a while so I will take a stab at this, mainly because there is no answer I take it that you have a variety of boards being produced at the same time and are in fixtures so the conveyors don�t need to be adjusted, a
Electronics Forum | Thu Sep 11 16:50:18 EDT 2003 | davef
Sure it's conceivable that thin HASL can cause tombstoning. Harkening back to the ample discussion in the fine SMTnet Archives, tombstoning is caused by an imbalance in solder surface tension between the two pads of SMT component. The source of thi