Electronics Forum: selective osp (Page 1 of 3)

ATE/ICT testing of OSP test points

Electronics Forum | Fri Aug 20 00:11:05 EDT 1999 | Rick Holmes

Anyone out there using OSP with double sided reflow and selective solder pallets? I am having trouble testing through what is left of the Entek Plus on the test pads.

Re: ATE/ICT testing of OSP test points

Electronics Forum | Fri Aug 20 05:17:25 EDT 1999 | Earl Moon

| Anyone out there using OSP with double sided reflow and selective solder pallets? I am having trouble testing through what is left of the Entek Plus on the test pads. | Think rotary. Earl Moon

Any PCB manufacturer can do 8 layer 1.0mm PCB with 2/2mil line?

Electronics Forum | Thu Jul 06 23:59:11 EDT 2017 | heros_electronics

We got an inquiry from US that requires high volume 8 layer 1.0mm PCB, OSP + selective ENIG surface, 5 groups impedance control, and stacked vias. These requirements are common, but there is 2/2mil lines in inner layers. It's said that this order was

How do you clean OSP PCB's without washing it off?

Electronics Forum | Thu Sep 14 20:11:19 EDT 2006 | davef

You weren't specific about the OSP that you use. We use Entek Plus CU-106A. Yes, just about everything removes Entek, especially if there's heat involved. Ethone states: * Alcohol strips 70% of the coating * Water removes 15% * Kyzen Lonox only t

OSP Surface Finishes

Electronics Forum | Wed Mar 21 15:33:16 EDT 2007 | pjc

Not all OSPs are created equal. Some companies use N2 in their reflow oven to minimize oxidation during reflow. This is for double sided reflow and if wave or selective solder will be done after reflow. Get extra boards from the vendor to test. Run t

Any PCB manufacturer can do 8 layer 1.0mm PCB with 2/2mil line?

Electronics Forum | Mon Jul 24 20:39:49 EDT 2017 | dawson

We got an inquiry from US that requires high > volume 8 layer 1.0mm PCB, OSP + selective ENIG > surface, 5 groups impedance control, and stacked > vias. These requirements are common, but there is > 2/2mil lines in inner layers. It's said that th

Re: Nitrogen to use or not to use

Electronics Forum | Tue Dec 21 08:33:54 EST 1999 | Nancy V

Luis, Go to the library on SMTnet and you will see Standard and Terms. Select that and you will be able to download the terms and definitions for SMT assembly. It is very useful. Of the terms you requested, only FPY is not there. I was curious a

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Fri Mar 29 00:18:05 EDT 2019 | SMTA-Vikram

3% NDF. We using 8oz 90 degree blade type razor probes, still same issue. Is there stencil we can use or selective pasting test via so flux will not build in testvia. any help or guidance will be appreciate.

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Thu Apr 11 00:54:49 EDT 2019 | SMTA-Vikram

Yes, we have try different Flux, probes. etc... also not to paste vs Paste Via, but still we have ~3% NDF due to contact issue. I am looking for selective pasting with less flux dispenser.Any idea or anyone has used? What about plug via before pas

Re: BGA ball size reliability

Electronics Forum | Wed May 12 20:32:14 EDT 1999 | Earl Moon

| Earl | | you posted a message on 1-14-99 about converting to VOC free flux. Have you completed your evaluation? Could I get a copy of any data supporting your conversion to VOC free? | | Thanks | | WDR | | WDR, We are awaiting the latest dat

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