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Electronics Forum | Thu Jun 25 08:24:13 EDT 1998 | Earl Moon
| Sorry Earl but as Superboy's dad I believe that makes me Superman as we did not remove him from the wreckage of a spacecraft. There is quite a bit involved in the FC process. The Kyushu Matsushita Electric Research Labs has been developing Flip C
Electronics Forum | Wed Feb 20 17:53:02 EST 2002 | djarvis
I certainly fit both citeria - 6'4" with a face like a bashed crab. I think I'm the one on the far right in white in the top picture at http://www.delicate.com/audio.htm which I believe is us at Mudd Island, Memphis in 1983. Alisa and Steve - now I
Electronics Forum | Mon Sep 23 12:37:56 EDT 2002 | genny
OK, back into the fray after being silent for several days. Yes maybe I was a little cranky. Sorry about that. However, I was starting from scratch, I knew nothing. I was nowhere near the point of evaluating whether XYZ machine was better than 12
Electronics Forum | Tue Mar 09 23:59:17 EST 2004 | fastek
Sr. Tech- I'll pipe in a bit as this is a touchy subject with me as well. I do feel that sometimes I am simply selling my way out of business when I export a piece of used equipment. However business for myself in THIS country has increased dramatic
Electronics Forum | Tue Oct 19 13:03:16 EDT 2004 | pjc
Electronics manufacturing moving to China is not about the labor man. You all don�t get it. It�s the material, and not just the electronics material either. Plastics and metal parts costs are lower. Labor costs are the smallest component of a produc
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
Electronics Forum | Wed Feb 09 21:37:37 EST 2000 | Dave F
Rob: Someone's out there turning over stones, eh? Roller Tinning, Rolled Solder. In printed circuit fabrication, a surface coating of tin-lead, typically 1-2 microns thick, applied to preserve solderability. Still available from some fabricators
Electronics Forum | Mon Oct 09 17:49:29 EDT 2000 | sean
Hello John, The biggest stumbling block is going to be taking these responses and applying them to your assembly process much the same as trying to make other manufacturers' defect levels apply to your process. Ultimately, the overall quality of yo
Electronics Forum | Tue Aug 29 05:58:28 EDT 2000 | Chris May
Andy, I have been "evaluating" some AOI systems. However, some of these are actually SAOI (Semi Automatic Optical Inspection), which is not a problem if that is what fits your process and budget. You can buy a high end system complete with many cam
Electronics Forum | Tue Apr 03 22:03:18 EDT 2001 | davef
With friends like you, who needs enemies? I�d guess that the perceived benefits of flat pads for your 20 mil pitch and below components counter-balance the higher cost, gold being a solder pot contaminant, limited solder mask compatibility, potentia
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