Electronics Forum | Wed Aug 09 09:43:31 EDT 2023 | boyabandaoti
Semiconductor is the material to make various electronic devices; The integrated circuit is the electronic device, that is, a certain process is used to make the crystal tube, resistance, capacitance and inductance in a circuit and the connection of
Electronics Forum | Tue Aug 22 09:30:31 EDT 2000 | Kelvin Chow
Mr. Lee, Although most of the lead free alloy used for solder paste and wave soldering have been identified, a suitable alloy used for leaded Ic packages (like QFP, PLCC..etc) have not been identified yet. Do you have any suggestion on this lead-f
Electronics Forum | Wed Jun 26 09:10:21 EDT 2002 | davef
I want to suggest: * IPC-2221, Generic Standard On Printed Board Design * IPC-222X, Sectional Design Standard For Printed Board For Y Printed Boards ... but I just thumbed through both quickly and saw nothing, I really didn't spend as much time as I
Electronics Forum | Tue Aug 01 09:56:22 EDT 2023 | boyabandaoti
Semiconductor is the material to make various electronic devices; The integrated circuit is the electronic device, that is, a certain process is used to make the crystal tube, resistance, capacitance and inductance in a circuit and the connection of
Electronics Forum | Wed Nov 17 09:02:57 EST 1999 | Dave F
John: The 180 Tg point is a sweet spot for obtaining heat resistance, cost effectivly. These high technology boards provide good thermal resistance for wire bonding, direct chip attach, and BGA mounting and rework. Since these boards are harder th
Electronics Forum | Fri Aug 08 07:27:43 EDT 2008 | lonta96
Hi, I'm from a semiconductor package assembly, and currently looking for an offline solder paste inspector capable of true volume measurement. Any recommendation for a machine that can measure paste volume on a leadframe (metal substrate)? I found
Electronics Forum | Wed Mar 26 20:48:22 EDT 2008 | davef
Sealing clip, clamps used in semiconductor, hybrid packaging * Connor Manufacturing Services; 16233 N.E. Cameron Blvd., Portland, OR 97230; 503-256-0230 F503-256-0246 connorms.com * Electro Assembly Source; 602 Sciandro Dr, Greensburg PA 15601; 724-8
Electronics Forum | Tue Apr 29 11:18:16 EDT 2008 | julienvittu
basically your problems come from the copper balance top and bottom side we are using substrate down to 0.18mm (semiconductor industry/ Bga package / SIp business) you have to respect 5% difference maximum between Top and bottom side otherwise you
Electronics Forum | Mon Jan 23 21:56:50 EST 2017 | jgo
Hi all, Am new to the SMT process. I'm in the process of purchasing a new SMT Pick & Place machine and am trying to figure out how to perform the buy-off. I'm from the semiconductor packaging background. For any new machine purchase, I'm used to se
Electronics Forum | Thu Dec 10 13:42:03 EST 1998 | Steve Stevens
I am interested in any information regarding possible failure mechanisms associated with active die (GaAs or Silicon Semiconductors) as a result of being exposed to RMA type fluxes and/or typical SMT industry cleaners. I know that corrosion is one s
