Electronics Forum: semiconductor packaging (Page 1 of 4)

Lead-Free Alloy composition used for leaded IC Packages

Electronics Forum | Tue Aug 22 09:30:31 EDT 2000 | Kelvin Chow

Mr. Lee, Although most of the lead free alloy used for solder paste and wave soldering have been identified, a suitable alloy used for leaded Ic packages (like QFP, PLCC..etc) have not been identified yet. Do you have any suggestion on this lead-f

Solder Robbing Pads

Electronics Forum | Wed Jun 26 09:10:21 EDT 2002 | davef

I want to suggest: * IPC-2221, Generic Standard On Printed Board Design * IPC-222X, Sectional Design Standard For Printed Board For Y Printed Boards ... but I just thumbed through both quickly and saw nothing, I really didn't spend as much time as I

Re: High Tg laminates

Electronics Forum | Wed Nov 17 09:02:57 EST 1999 | Dave F

John: The 180 Tg point is a sweet spot for obtaining heat resistance, cost effectivly. These high technology boards provide good thermal resistance for wire bonding, direct chip attach, and BGA mounting and rework. Since these boards are harder th

solder paste volume

Electronics Forum | Fri Aug 08 07:27:43 EDT 2008 | lonta96

Hi, I'm from a semiconductor package assembly, and currently looking for an offline solder paste inspector capable of true volume measurement. Any recommendation for a machine that can measure paste volume on a leadframe (metal substrate)? I found

Sealing Clips

Electronics Forum | Wed Mar 26 20:48:22 EDT 2008 | davef

Sealing clip, clamps used in semiconductor, hybrid packaging * Connor Manufacturing Services; 16233 N.E. Cameron Blvd., Portland, OR 97230; 503-256-0230 F503-256-0246 connorms.com * Electro Assembly Source; 602 Sciandro Dr, Greensburg PA 15601; 724-8

Board Warpage

Electronics Forum | Tue Apr 29 11:18:16 EDT 2008 | julienvittu

basically your problems come from the copper balance top and bottom side we are using substrate down to 0.18mm (semiconductor industry/ Bga package / SIp business) you have to respect 5% difference maximum between Top and bottom side otherwise you

How to perform buy off a new Pick & Place machine

Electronics Forum | Mon Jan 23 21:56:50 EST 2017 | jgo

Hi all, Am new to the SMT process. I'm in the process of purchasing a new SMT Pick & Place machine and am trying to figure out how to perform the buy-off. I'm from the semiconductor packaging background. For any new machine purchase, I'm used to se

Use of fluxes (RMA) Flux cleaners on and around un-packaged microcircuits (GaAs, Silicon Semiconductor die)

Electronics Forum | Thu Dec 10 13:42:03 EST 1998 | Steve Stevens

I am interested in any information regarding possible failure mechanisms associated with active die (GaAs or Silicon Semiconductors) as a result of being exposed to RMA type fluxes and/or typical SMT industry cleaners. I know that corrosion is one s

Contamination under chip resistor array

Electronics Forum | Thu Aug 21 08:33:09 EDT 2008 | davef

There is no standard as such. It's easy to see why. It's too complicated and has such a small payoff. Standoff is comprised of: * Package height * Solder thickness between the pad and the component lead * Delta of pad thickness and solder mask For p

Re: uBGA

Electronics Forum | Tue Oct 20 10:57:18 EDT 1998 | Craig Ramsey

Dear Bob, The Tessera microBGA technology defines a family of CSP devices. The most common microBGA type is the TV46 that has been selected by Intel for use with their flash memory devices. A microBGA package in general consists of the silicon die

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