Electronics Forum | Wed Apr 02 22:26:13 EDT 2014 | isd_jwendell
I've been using the SEP1M, which functions well for mechanical separation. I recommend the motor driven version. http://www.olamefusa.com/e_sep1.htm#SEP1M
Electronics Forum | Wed Sep 17 08:32:07 EDT 2014 | max83
File: CAMERMOD.C Line: 5424 Routine: vis_initialise_vision_system Error: 102 Time: Wed Sep 17 08:39:28 2014 Inside log.
Electronics Forum | Fri Nov 11 10:19:35 EST 2005 | davef
0.3 mg/l) is a �hazardous substance containing waste�. Disposal permitted only in controlled landfills, mfrs. pay extra costs (Waste Disposal and Public Cleansing Laws). * South Korea: Korean Electronics Industry Declaration to Manufacture Environmen
Electronics Forum | Mon Oct 05 03:45:03 EDT 1998 | Thomas Blesinger
I have posted a question in your forum on the 17th of Sep. and received an answer from Dave F. I would like to contact him directly via e-mail. is that possible, and can you help me with his address. I like your site and visit quite often. Kind rega
Electronics Forum | Mon Apr 06 05:51:55 EDT 1998 | Yeo Sye Chai
You can do some reading-up from Circuit Assembly Sep 96 and Jun 97. The problem is that they tell you only the good things and seldom evaluate them critically. I will be interesting to see what you want to do with the metal fence! (I presume is it th
Electronics Forum | Mon Oct 05 09:41:53 EDT 1998 | Clifford Peaslee
| I have posted a question in your forum on the 17th of Sep. and received an answer from Dave F. I would like to contact him directly via e-mail. is that possible, and can you help me with his address. | I like your site and visit quite often. | Kin
Electronics Forum | Tue Feb 13 16:28:17 EST 2007 | rob_thomas
There are solder pastes that seem to give you less voiding. Currently we are using Kester ,water soluble paste that gives us pretty good results on BGA's up to 0.5mm pitch. Stencil design was a challenge but we are getting consistent results . Here
Electronics Forum | Tue Sep 18 13:58:01 EDT 2001 | ert002
50%) only over the appertures where there was poor support. Most prints took 2 knead strokes to print OK, but this caused fine pitch leaded devices to almost short. stencil had to be be wiped after kneading. 2 similar devices with exactly the same
Electronics Forum | Thu Feb 28 07:57:52 EST 2002 | caldon
Marcos- BGA's and soldering manually is difficult. Typically soldering BGAs requires reflow just as a reflow oven does, so I recommend a rework station. Go to http://www.empf.org/html/empfset.htm and download Jan 2002, Dec 2001, Sep 2001, Aug 2001,
Electronics Forum | Sun Mar 14 15:49:05 EST 1999 | Steve Gregory
5 GOLD PLATING (EDGE CONNECTORS): UP TO 50 MAX. MONTHLY PRODUCTS: 300,000sf FOR ODM OR OEM PLEASE CONTACT US Best regards, Eddy Chen EVERGREEN HITECH CONSULTANTS LTD. TEL:886-2-7667722 FAX:886-2-7630734 E-MAIL: mailto:evcons@ms3.hinet.net 7th Fl., No
