Electronics Forum | Wed Apr 24 10:32:47 EDT 2002 | dougt
BGA's are sometimes difficult for a camera to recogonize as your not looking for the dark outline of a part with white lighting behind it but rather the white balls with in that dark component. If you don't mind experimenting a little I would play wi
Electronics Forum | Wed May 15 17:49:44 EDT 2002 | slthomas
We have two E5's, and like them a lot. If money were easier to come by we'd buy one more. Tech. support is excellent, print quality is good (I only have semi-auto clamshell machine prints to compare them to, and it's no comparison). They don't offe
Electronics Forum | Tue May 28 10:37:34 EDT 2002 | Mark Susol
Maybe we should better define the type of line and the expected utlization? Are you a contract mfg. or is this your own product line? Are you hi/low mix - hi/low volume? I have a hi-mix/low volume Siemens line (S23/F5) that I am able to get 40-60% u
Electronics Forum | Wed May 22 13:07:43 EDT 2002 | melsolutions
Tim, have you considered how efficiency software plays a role in the matrix? Most software from equipment suppliers tends to be programming driven. I have run across a software product from Timms that does an excellent job of controling things lik
Electronics Forum | Tue Jul 02 08:59:14 EDT 2002 | jax
On an IP3, from what I remember, the BGA Part data is defined from center part moving out towards part edge. If your pick up point is a little off this problem can occur. Otherwise, Check your gain and offset settings. The machine is probably recogni
Electronics Forum | Tue Jun 25 05:28:45 EDT 2002 | ianchan
Vapour Phase is a "phased out" technology. Hot Air Convection is the commonly acceptable type of Reflow Oven. Some folks are getting good improvements for "IR + Hot Air Convection" (combined) Oven technology. Nitrogen Ovens have their own set of p
Electronics Forum | Tue Jun 25 15:30:49 EDT 2002 | Steve L
Hi everyone. I am now faced with a problem on soldering PBGA. At first, I ran the board (FR4, 7" X 10" with 12 layer) at Peak Temp: 205 C and 54 seconds above 183 C. After reflow, I found several cold solder joints and one ball without second collaps
Electronics Forum | Thu Jun 27 11:22:03 EDT 2002 | robbied
Hi there. We have had an out of control reflow oven that has allowed its temperature to fluctuate by up to +/- 20 deg C from set point in very short periods of time. We found the root cause of the problem and fixed it, but by then we had already run
Electronics Forum | Tue Jul 09 08:29:10 EDT 2002 | r_sturdevant
I agree with others here who have questioned the amount of solder and reliability of the joint when using this aperture shape. I have had experience with these with MELFS, and the main issue I've seen comes when cleaning the stencil - all those littl
Electronics Forum | Tue Jul 16 21:30:00 EDT 2002 | davef
Comments are: * Strap-testing has its problems. Sure, compliance is a pain in the keester. Yes, straps are only tested a couple of times a day. Ladeda. But, people need to understand and accept the importance of proper process. If they are not c