Electronics Forum | Wed Mar 16 09:06:07 EST 2005 | russ
This is what I might do, I would purchase either a solder volume (preferred) or at the least a paste height measurement piece of equipmment, The most important parameters with pronting are volume and registration. You need one of these inspection
Electronics Forum | Thu Mar 17 10:56:24 EST 2005 | jmedernach
Hi John, This problem is interesting. I've never had a problem with solder shorts caused by subjecting a device to reflow a second time. I've built many double sided SMT assemblies with fine pitch devices on top and bottom. Some things to possibly
Electronics Forum | Mon Mar 21 02:51:23 EST 2005 | amstech
I have done few thermocouples using high lead solder, silver epoxy that is used for die attach purposes and some X - non conductive material. Though all materials show a slight variation in temperatures (3 to 5 degree C), the dwell time at peak is qu
Electronics Forum | Tue Mar 22 12:11:15 EST 2005 | jdengler
Bob, I don't have 300 stencils only about 83 so my way might not be practical for you. This is what I have done. 1. I have racks that hold 20 stencils, 10 top 10 bottom. 2. Number the racks and have them in order. 3. Made a number system for locati
Electronics Forum | Thu Mar 24 22:39:22 EST 2005 | pmd
My opertaors have lots of setup problems with vib feeders. They dont realize that the chip weight pushes parts down and when feeders run low it's the frequency that drives the parts. Mixing parts with diferant phisical deminsions and masses in the sa
Electronics Forum | Sat Apr 09 23:14:36 EDT 2005 | MikeaJ
In response to the post concerning the UP1500, the case is a little different. The Speedline/SMTech passwords are hardcoded into the Sigpro.exe file. Here is what you need to know: Login name: Speedline (or SMTech) Passwords are listed in order of ri
Electronics Forum | Thu Apr 14 06:54:02 EDT 2005 | teera
hi! below are the item need to check: 1)top plate condition(under screen squeegee). 2)under screen clean contact position(with stencil) 3)make sure the thickness of wiper paper not so thick(not over 6o gm)becaue it will effect the vacuum suction. 4)s
Electronics Forum | Wed May 04 10:27:33 EDT 2005 | nice90
Or you can use the Hot Air (Hakko) to remove that component and a tweezer to pull it. dont pull it just yet. If you see the solder melting then feel the component using the tweezer by wiggling it a bit and if you can wiggle it only then you can pull
Electronics Forum | Mon May 16 11:45:35 EDT 2005 | PWH
Agree with PDE. We have two GSM's and we get this error often. Palm down e-stop when you get this error message. Machine will drop nozzle bank down after doing some segment repairs. Open covers and make sure nozzles are seated in reference to ali
Electronics Forum | Wed May 18 04:17:05 EDT 2005 | kvanzill
Hello All, I recently accepted a position in a manufacturer in Mauritius and they have begun a little more then a year ago COB process which I am unfamiliar with and needing some help. We are using aluminum wire, the machine is Dias Automation model
