Electronics Forum: sets (Page 416 of 456)

Re: Poor solder joints on QFP 100's

Electronics Forum | Mon Dec 13 19:34:09 EST 1999 | Steve Thomas

Thanks, gentlemen. All points well taken, and some hit pretty close to home. Our pick-and-place programmer assures me that coplanarity isn't the issue because the machine won't (or can't) place parts beyond an acceptable criteria. It's an Amistar

Re: 0603 Solder Beads

Electronics Forum | Mon Nov 01 16:41:58 EST 1999 | Robert Culpepper

Hello Mark, I can�t provide any hands on feedback with 0402 packages but we are using a no clean process with 0603 devices. Here are some parameters which will affect solder balling. Stencil thickness, aperture size, paste viscosity, snap off and bot

Re: HELP!! via sizes, location

Electronics Forum | Wed Oct 06 04:23:09 EDT 1999 | Brian

| | I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 12:03:12 EDT 1999 | Graham Naisbitt

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 23:36:28 EDT 1999 | karlin

| | | Hi, | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | Question: | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Fri Oct 08 02:31:07 EDT 1999 | Brian

| | | | Hi, | | | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | | | Question: | | | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowab

Re: BGA shifting

Electronics Forum | Tue Sep 28 10:29:28 EDT 1999 | Wolfgang Busko

| Dear all, | | We've got a curious problem. We have had a major problem with BGA's occasionally being placed one to several rows or columns off the pads. We are using Universal's GSM2 platform for our general purpose placements. Our Universal re

Re: opinion of these rework stations

Electronics Forum | Wed Sep 29 12:51:55 EDT 1999 | Bob Barr

Never heard of the DRS-22C. I have had a DRS-22 for several years now. Purchased it when we started doing BGA's. The operators like it - good optics (split view), built like a tank, X-Y table easy to manipulate for alignment. I like it because I ca

Re: Help!

Electronics Forum | Tue Sep 28 05:28:46 EDT 1999 | Wolfgang Busko

| | | I'm trying to start a small SMT contract shop and I need | | | assistance in selecting equipment. Quad seems to be the | | | leader but if there is something else out there that can | | | better suit me please let me know. My shop starting out

Re: Help!

Electronics Forum | Tue Sep 28 09:07:02 EDT 1999 | Scott Cook

| | | I'm trying to start a small SMT contract shop and I need | | | assistance in selecting equipment. Quad seems to be the | | | leader but if there is something else out there that can | | | better suit me please let me know. My shop starting out


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