Electronics Forum: shape (Page 11 of 94)

Re: OSP surface finish.

Electronics Forum | Thu May 25 21:50:27 EDT 2000 | Dave F

Bill: I'd expect better gasketing on a nice flat solder mask surface rather than the edge of the stencil opening mashed down on a irregular shaped hunk of solder attached to a pad. Stop thinking and get printing Dave F

Solder paste amount

Electronics Forum | Wed Jan 17 03:06:56 EST 2001 | George English

You can try : Optimum pad design and solder joint shape for reliability. written for the NPL(England) by Milos Dusek and Chis Hunt, (good ol' English names !!) or of course the IPC guidelines IPC-7525 Regards G

In-line x-ray inspection systems.

Electronics Forum | Mon Jun 18 11:06:31 EDT 2001 | Gil Zweig

In-line systems are effective in detecting the obvious defects such as solder bridges, missing balls and excessive solder voids. They may not be as effective in detecting the subtle changes in solder bond shapes (signatures) indicating loss or chang

Printing problem, water soluble paste with gold plating PCB..

Electronics Forum | Wed Aug 01 06:52:25 EDT 2001 | Mark

please look at trying lazer cut stencils. They have trapozoidal shaped apertures and this could assist with the paste releasing onto y the PCB

Screen Printing of Surface Mount Adhesives

Electronics Forum | Mon Jan 03 10:17:00 EST 2000 | Mark D.

Does anyone know of a good technical reference source that deals with the screen printing of surface mount adhesives? I'm looking for help in adhesive selection and guidelines for designing aperture sizes/shapes for typical B/S wavesolderable SMT com

Dross characteristic

Electronics Forum | Sat Oct 09 01:13:31 EDT 1999 | Glem brian

Always experiencing dross in pot with different characteristic such as color, shape, dry/wet etc. Any paper, wetsites provide the more comprehesive explanation on its characteristic

Re: Dross characteristic

Electronics Forum | Sat Oct 09 08:35:34 EDT 1999 | Dave F

| Always experiencing dross in pot with different characteristic such as color, shape, dry/wet etc. Any paper, wetsites provide the more comprehesive explanation on its characteristic | "Dross Myth Vesus Fact," R. Woodgate, SMT, 10/98

De-panel

Electronics Forum | Wed Sep 15 11:10:44 EDT 1999 | D.Rusher

Looking for a manual machine to de-panel with the panels held by 60mm tabs. Each panel hold multi-boards consisting of different shapes and sizes. Scoring is apparently not an option and volume does not dictate a large scale machine.

Cylindrical diodes Missing during SMT process.

Electronics Forum | Tue Aug 24 02:33:00 EDT 1999 | Gyver

Hello everyone, We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. Gyver

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Tue Aug 24 05:11:32 EDT 1999 | George Verboven

| | Hello everyone, | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. | |


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