Electronics Forum | Thu May 10 08:56:38 EDT 2001 | stefwitt
I think the main purpose of cleaning a fiducial is not to make them nice and shine, but to get a haze on them. In particular dome shaped fiducials create too much reflection from the light source and distort the image. The eraser pencil is a bandage,
Electronics Forum | Thu Jun 14 21:43:17 EDT 2001 | davef
I know this isn't what yer asking about, but this stuff is so coo [http://www.intertronics.co.uk/products/cpreleg.htm]. We just screw a U shaped tip on the iron and go!!! Preleg Inc [Rework wire # 210302] 524 Paul Morris Ave., Ste. E Englewood, FL
Electronics Forum | Mon Jun 18 16:48:00 EDT 2001 | Gil Zweig
We have found a significant number of PBGA problems associated with physical deformation of the package. Deformations such as dishing (potatoe chipping) and delamination under the die (popcorning). These can be detected by x-ray by the variation patt
Electronics Forum | Thu Nov 11 05:30:09 EST 1999 | Wolfgang Busko
For me it sounds like to much paste. If it worked in former runs with the same design and stencil look for changes in your printing process, check the volume and shape of your deposit. Redesigning pads and playing with aperture size allowing for mor
Electronics Forum | Wed Sep 15 11:49:58 EDT 1999 | Scott S. Snider
| Looking for a manual machine to de-panel with the panels held by 60mm tabs. Each panel hold multi-boards consisting of different shapes and sizes. Scoring is apparently not an option and volume does not dictate a large scale machine. | Try CAB T
Electronics Forum | Tue Aug 24 06:40:18 EDT 1999 | Gyver
| | | Hello everyone, | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. |
Electronics Forum | Tue Aug 24 11:36:37 EDT 1999 | Jimmy G
| | | | Hello everyone, | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advanc
Electronics Forum | Tue Feb 16 18:27:07 EST 1999 | Ken D
We appear to receive certain standard discrete components (1206,0805,&0603)that deviate in size and shape to the extent that vision processing discard rates are through the roof. Does anyone else have problems with vendors being unable to produce c
Electronics Forum | Wed Jan 13 17:08:20 EST 1999 | Jim Nunns
I have some BGAs with a warped chip carrier. Some of the balls are tall like columns and some are short oval shapes. How can I determine when warpage will cuase failures from stress. Is there a spec out there from studies anyone has done? Any commen
Electronics Forum | Mon Dec 14 13:16:11 EST 1998 | MMurphy
| DO you know of an Industry Standard that describes solder paste geometries requirements? | Check out www.alphastencil.com and select "Stencil Design Guidelines". This will at least give you an idea of how to deposit optimum paste volumes based on
