Electronics Forum: shape (Page 46 of 94)

Pattern Design for Panasonic Right Angle LED's

Electronics Forum | Fri Sep 15 10:00:15 EDT 2006 | Joe C.

Hello Everyone, Does anyone have any experience with an SMT right angle LED from Panasonic, part number LNJ123W8PRZ. In our experience the pattern design from the vendor was not very effective (the part swam around on the pads & flipped backwards dur

Pin-in-Paste, Intrusive Reflow, Solder Preforms, etc.

Electronics Forum | Mon Dec 04 14:27:18 EST 2006 | pjc

Solder preforms can be used in SMT assembly for through-hole pin-in-paste process. In this process and modified aperture is used to print the paste with standard stencil printing, then a solder preform is picked and placed by a machine into the solde

Pin-in-Paste, Intrusive Reflow, Solder Preforms, etc.

Electronics Forum | Fri Dec 15 03:16:11 EST 2006 | pavel_murtishev

Good morning, The critical points for successful PIP technology are: 1. Gap between THT lead and PHT hole. It shouldn�t be greater that 0.2mm; 2. Lead shape. THT leads MUST be straight or you�ll get excessive voiding otherwise; 3. As Russ said, pas

Indium Solder Hermetic Seal Voiding

Electronics Forum | Tue Jan 09 21:21:22 EST 2007 | behrsam

I am soldering a Germanium Window with a metalized rim to a Ni-Au plated kovar lid. The solder joint needs to be hermetic. I am using 80In solder washer shape preform, but am experiencing lots of voiding when x-rayed, although the joint is sealing.

Wave solder joint on PTH part

Electronics Forum | Fri Jan 12 17:33:56 EST 2007 | John S.

I've not seen it on a solder joint, but I've seen it on an SMT pad that had been skipped in a wave solder operation. The boards were under inspection for poor solderability. We never really pinpointed the cause. It would make a perfect 6 pointed s

Lead free rework of BGA

Electronics Forum | Wed Jan 17 15:13:24 EST 2007 | jaime39

When placing the part to be reflow try applying heat to the board from the secondary side until the primary side has a temperature of about 130 degrees celcius. Following this procedure it should minimize the heat exposure of the part being soldered.

Wire Bonding fiducial mark specifications

Electronics Forum | Tue Jan 30 08:21:02 EST 2007 | GS

Please who can help me? I am looking for fiducial (cross shape) mark (target mark? Swiss mark?..)specifications used when COB wire bonding on PCB laminate. Pad pitch should be 250umm may be 220umm?). Mainly need to know which are the tolerances

DEK pro-flow

Electronics Forum | Fri Feb 16 09:16:19 EST 2007 | John S.

We conducted a DOE to establish our print setup parameters. These will of course depend on the paste you select, and the thing just runs. The techs store the head in a ziplock bag when not in use. When they need to run, they just attach the head,

SMT on Flexible circuits

Electronics Forum | Thu Feb 15 08:34:50 EST 2007 | rgduval

Jim, In a previous life, we built some flex circuits for a customer. The configuration was a flex cable, with a circuit at one end of it. We had fixtures made out of the same material that we had selective wave solder fixtures made from. Cut an i

HOW TO REDUCE MACHINE COMPONENT ATTRITION?

Electronics Forum | Tue Apr 03 01:17:57 EDT 2007 | Haris

Dear all, One of the major reason is that some components have curved shape terminations and thats why their attrition rates are high. So CORRECT THEIR VISION FILES OR IF PROBLEM REMAINS THE SAME THEN INCREASE THE TOLERANCE OF THAT COMPONENT VISION


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