Electronics Forum | Mon Jul 24 23:34:14 EDT 2000 | rzkr438
I am tyring to find out shear force requirement for BGA attached on board .I measured two group for shear force to check underfill process effectiveness on BGA .Two group showed siginificant force diferrence .I am very sure underfill process is effec
Electronics Forum | Fri Mar 30 18:24:12 EST 2001 | davef
There is no test. Beyond the issues that you mentioned that affect shear, an article published in a recent [1/01] "Journal Of Surface Mount Technology" documents that shear is also dependent on the rate of shear. You may be able to contact the auth
Electronics Forum | Fri Mar 30 13:06:50 EST 2001 | aortiz
Hi, I need support on the method or applicable standard to measure the shear force strength on chip capacitors and resistors. I know the soldered joints strength is related to land desing, solder volume, pcb and component solderability, component
Electronics Forum | Fri Mar 30 20:06:55 EST 2001 | aortiz
Maybe there's no test and I don't know where or why my customer came with that requirement (I think because in one of the board shipments he got a board were a smd resistor broke, but I think that happened because miss handling), but anyway I need so
Electronics Forum | Sat Mar 31 08:47:24 EST 2001 | davef
Sure, researchers measure shear as an element of their material characterization process, but that does not make it an acceptance test. [Truly, this conversation is not uncommon on SMTnet. So, it would not surprise me if an enterprising something o
Electronics Forum | Wed Jul 03 15:40:17 EDT 2013 | davef
Shear tests are [in my opinion] senseless. The shear stress you measure depends more on the shear rate and on the point where the force is applied than on the grain structure. When shearing a component, you not only apply shear stress, but also roll
Electronics Forum | Tue May 23 20:39:37 EDT 2000 | Dave F
Scott: Sounds like fun: � Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the test method. � Among things, IPC-TM-650 talks to getting pads off-of boards. For instance: Method 2.4.8 is for
Electronics Forum | Fri Nov 13 14:09:02 EST 1998 | Dave F
| Anyone using SMT "Fair-Rite" beads? We have a P/N 2743019447 that we're using. We need to know the shear force strength of the part and the vendor's man who knows is in Deutschland and can't help until Monday. I can't wait that long. | | Also, do
Electronics Forum | Fri Nov 13 11:29:59 EST 1998 | smd
Anyone using SMT "Fair-Rite" beads? We have a P/N 2743019447 that we're using. We need to know the shear force strength of the part and the vendor's man who knows is in Deutschland and can't help until Monday. I can't wait that long. Also, does any
Electronics Forum | Wed Dec 10 11:11:04 EST 1997 | Rich Scheleski
Is there a spec for the adhesives used to hold down parts before wave soldering. What size dots are recommended and what is the maximum shear force(1LB?) tested for to ensure good adhesion. Your help is appreciated Rich Scheleski