Electronics Forum: shine ofsolder joint (Page 1 of 1)

Switching to 62/36/2

Electronics Forum | Wed Oct 15 19:11:40 EDT 2003 | dlkearns1

Can also reduce leaching of certain types of components. Also, dont expect to see a "shiny/bright" joint if running Nitrogen in the relfow unit, you'll see a dull/smokey like joint...if running Air then sure,let SHINE! my 2Cents DaveK

CCGA solderability criteria

Electronics Forum | Thu Jun 19 05:14:18 EDT 2008 | sckee

Hi, Need help on the CCGA solderability criteria.I've actually run a NPI that using CCGA yet not sure whether the solderability is accepted or not. The alloy of the column is 80/20 and the surface of the solder joint is not smooth and shine. By chec

lead free process

Electronics Forum | Tue Oct 21 23:28:59 EDT 2003 | xz xiao

We all know the Lead Free process is trend, so we trial run it, now it is only my comment that we have a good achievement after several tries,we have taken serveral photos about Lead Free process with ErsaScope. 1.The surface of the solder joint are

lead free process

Electronics Forum | Tue Oct 21 23:29:08 EDT 2003 | xz xiao

We all know the Lead Free process is trend, so we trial run it, now it is only my comment that we have a good achievement after several tries,we have taken serveral photos about Lead Free process with ErsaScope. 1.The surface of the solder joint are

QFP144 soldering problem

Electronics Forum | Wed Sep 05 07:07:25 EDT 2007 | mun4o

hi, I have a big problem with soldering uP QFP144 package.All components in PCB are small, only this chip is big and I can't make good temperature profile.Solder joints of other components are shining and with good wetting, but in QFP leads solder j

36PB/62Sn/2Ag Vs 63Sn/37Pb

Electronics Forum | Tue Aug 14 21:43:44 EDT 2001 | mugen

Basic understanding, 1) the 2% silver (Ag) gives better shine *joint surface*. 2) Ag improves stength & fatigue resistance of solder joints 3) reduces leech-out of silver from silver-base substrates (eg of such silver-base surface contact: metalli

BGA inspection scope - Visual

Electronics Forum | Thu Jun 12 11:12:08 EDT 2003 | babe

The last statement saying that seeing down the bga component with these systems is useless, is an incorrect statement. First with x-ray you do not see flux residue and or flux migration, second with x-ray you do not see a cold solder joint. Visual i

Books for SMT

Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef

DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b

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