Electronics Forum | Tue Feb 17 13:47:33 EST 1998 | Chrys Shea
| I am currently evaluating some different reflow ovens | for a future purchase. The manufacturers we are | looking at are Conceptronic, BTU, and Heller. Any | feedback on these manufacturers would be welcome. | I am particularly interested in: | 1
Electronics Forum | Sun Feb 15 18:07:18 EST 1998 | Scott McKee
| I am beginer in BGA assembly and am confused in selection of pick and place option. As per book on 'implementation of BGA Technology-by 1995 aeic inc. states that BGAs reflow is quite forgiving and you need only Mechanical centering of PBGAs. The I
Electronics Forum | Sat Feb 14 13:33:10 EST 1998 | ashok dhawan
| I am beginner in BGA assembly and am confused in selection of centering method on pick and place operation.. As per book on 'implementation of BGA Technology-by 1995 aeic inc. states that BGAs reflow is quite forgiving and you can use Mechanical c
Electronics Forum | Fri Feb 13 12:53:09 EST 1998 | Energy Technology Systems
ETS, Energy Technology Systems, would like to prove the capabilities of the CUREFLOW System (Solder Reflow and Curing Ovens)to you first hand. If your company is in the market to purchase a new reflow oven and would like to make that purchase ris
Electronics Forum | Wed Aug 08 11:52:06 EDT 2001 | Michael Parker
Your reply with the reason for wanting the BIC data finally exposed the root cause of your problem. Good luck with trying to educate your suppliers. I have had copiuos amounts of experience with Asian cultures. First, you gotta know that they have a
Electronics Forum | Tue Sep 18 09:13:13 EDT 2001 | davef
Those of us that appear deaf are only faking. So, you need not yell. Responding to your question, consider: * Contacting the contractors and ask them for the information you desire. Most of the larger contractors are public companies. So, much of
Electronics Forum | Thu Sep 27 16:11:38 EDT 2001 | flipchip
Monkey, I have read all the replies you received. I have extensive experience in reworking these parts. There are several ways to approach your problem. If the chips are bumped you will need to have a stencil to apply the flux. If the chips are u
Electronics Forum | Wed Sep 26 11:15:59 EDT 2001 | Hussman
What do you folks use for control on your wave solder process? Primarily after wave. I know there are a variety of "wave riders" that will assure proper wave solder parameters, but would like to know what down stream controls some are using. We ar
Electronics Forum | Fri May 02 09:37:23 EDT 2003 | Jerry Magera
Via in pad is the most efficient use of space. Blind via seems to be blamed for this. Cross-sections (send me some) will probably show a void still existing in the via or spherical voids aligned near the component pad side. One can estimate the vo
Electronics Forum | Thu Dec 06 11:01:19 EST 2001 | Carol Stirling
This SMT process certainly makes a body want to win the $$$ and retire! We have been trying to stabalize the process and keep running into new problems. Any help would be appreciated on this issue. All pads on both sides have the same look - partial
