Electronics Forum | Fri May 01 09:53:24 EDT 2009 | kevslatvin
APS/Novastar usually bakes cookies in thier ovens at trade shows. At least both times I've been to Apex they had cookies going through one of thier ovens. Granted these were new ovens with no PCBs through them yet. Made good cookies though.
Electronics Forum | Tue Jul 07 08:42:49 EDT 2009 | ewchong
kpm, you are probably right. under magnification those two pads show some exposed copper which means that they were contaminated or had insufficient solder paste before reflow.
Electronics Forum | Tue Jul 21 06:23:07 EDT 2009 | Jeff
Instead of using a conversion box just make your own cable. Look in the Dek manual, volume #2, chapter 18. It shows you how it's wired. Easy to make and looks allot cleaner than those conversion boxes.
Electronics Forum | Thu Aug 06 12:46:15 EDT 2009 | jorge_quijano
Yes, it is centered, in fact is the same product we run everyday, problem shows up after maintenance was performed.
Electronics Forum | Fri Oct 23 17:40:19 EDT 2009 | gregoryyork
So if you have Carbon showing on this would this not mean it is something Organic contaminating the pad.I have seen this before with solder resist depositing over the pad.
Electronics Forum | Sat Sep 12 10:12:20 EDT 2009 | tylaburg
My customer wants an SnPb 63/37 BGA soldered using SAC305 solder paste. What data is avaiable showing the long term reliability of the intermetallics of the solder joints?
Electronics Forum | Mon Oct 05 18:53:08 EDT 2009 | smt_guy
this is what they call hybrid soldering....i missed the discussion at the IPC Show in Chicago... Can someone with hybrid soldering idea share some? thanks
Electronics Forum | Tue Jan 12 15:54:09 EST 2010 | chupitoone
Hi, Orbotech actually sold it's division to ORPRO Vision. They development of the equipment is still progressing in both their Reflow inspection and SPI systems. Both have newer versions of software released and at the show in SanDiego they demonstr
Electronics Forum | Sun Nov 22 18:40:47 EST 2009 | 89jeong
Hi The bubble shows only around component body after ir reflow. I think bubble means that there is a moisture. How do you dry the PCB(?) before IR reflow? Thanks Ju-young.
Electronics Forum | Sun Nov 22 19:53:10 EST 2009 | prodrivegsr
Hi Ju Yong, The PCB are dry in an airseal cabinet(Staging Chamber) before IR Oven. The bubbles show at around body and solder joint area. You mean the moisture will create bubbles ? Able to advice the humidity and temperature that you are using in
