Electronics Forum | Mon Jan 30 10:01:07 EST 2017 | smduke
Hello and thanks in advance. I am new to this stuff, I bought a wireless transmitter receiver and am wondering how to connect the power source, a buzzer to the receiver and a led light to the receiver. attached is a screen shot of what I have and wh
Electronics Forum | Mon Jan 30 12:35:31 EST 2017 | davef
Look here: http://arduinobasics.blogspot.com/2014/06/433-mhz-rf-module-with-arduino-tutorial.html
Electronics Forum | Thu Feb 02 16:59:54 EST 2017 | smduke
thank you, that will help. I also purchased a beginner kit so I can learn how to use this stuff.
Electronics Forum | Sun May 22 23:31:51 EDT 2005 | thaqalain
If 1 & 2 are low, then 3 will be low: *Always *Sometime *Never
Electronics Forum | Mon May 23 08:34:20 EDT 2005 | davef
http://www.semiconfareast.com/logicgates.htm
Electronics Forum | Mon May 23 09:15:09 EDT 2005 | dougt
And Gate If one/both inputs are low, output will be low If both inputs are high, output will be high
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Mon Jun 26 12:23:11 EDT 2006 | Rob
Yep, Book a holiday and let someone else sort it out. Otherwise e-mail me and I'll talk you through pallets, rigidisers, printer tooling, spray mount, Kapton tape, local fiducials (panels can strech & shrink) etc. Oh, yeah - for the connectors you
Electronics Forum | Wed Jun 05 21:33:12 EDT 2002 | davef
Tough to say based on what you have told us. Things to Determine are: * Is the heat at the solder connections that are not reflowing properly adequate? * Is the pad surface of the solder connections that are not reflowing properly solderable?
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