Electronics Forum | Thu Dec 07 13:51:59 EST 2006 | ganoi
I need advices as to how a gap between the bottom of an LED (1209-package) and the PCB can be controlled on a small rigid-flex PCBA? The problem that we experience is due to tight tolerance in the design of our molded housing in which this PCBA is as
Electronics Forum | Fri Dec 08 16:54:42 EST 2006 | flipit
My experience with SMT LED packages is that certain LED package styles tend to float. This floating is caused because the LED is often only terminated on the bottom side of the LED package. Sometimes the LEDs are terminated like a SMT resistor with
Electronics Forum | Mon Feb 05 07:02:11 EST 2007 | CL
ASIR, Findings for us so far: OSP- has worked well for us for single sided boards only. We have seen problems with using it on double sided reflow applications. Also, some customers have specified OSP, but are intolerant of exposed copper. Limited
Electronics Forum | Thu Mar 01 12:08:33 EST 2007 | rob_thomas
It sounds like something is a little off here. ROHS compatible and ROHS capable parts are going to be ok with a leaded solder paste and processing unless you are building high reliability product.( some are going to argue that even high rel products
Electronics Forum | Tue Feb 27 11:03:09 EST 2007 | Marcin
Hi All, Anybody knows what is the minimum clearance between through hole component and chip component? Problem description: On bottom side of my pcb are only 0603 chip components mounted on glue. One of the component is located very close to hole
Electronics Forum | Wed Apr 04 19:10:20 EDT 2007 | rgduval
Pete, Top-side temp might be an issue. What's the easiest way to check it? I seem to recall some thermal decals that we used to use a couple of jobs ago. I spoke with the flex manufacturer, and they recommended 4 hours at 250 degrees pre-process
Electronics Forum | Mon Jul 16 10:44:29 EDT 2007 | Jacky
Hi All, Recently, we encountered strange defect at our SMT line. We can see solder ball spatter around at one of the component pad. This lead to insufficient solder defect at 1 side of the component. The other side of the component look good(Meet
Electronics Forum | Mon Aug 13 05:39:31 EDT 2007 | saaitk
I am building a double sided SMT board. On the first side I have a 405 ball BGA. When we build and run the second side through our reflow oven on about 25% of the boards run the 405 ball BGA on the underside of the board has fallen off. About 80% of
Electronics Forum | Mon Apr 14 16:21:58 EDT 2008 | ck_the_flip
Bottom-side SMT parts CAN and DO go liquidus during the 2nd reflow cycle. It could be that there was enough variability between the 2 different lot code PCBs to cause the parts to fall off. Remember wetting force determines surface tension (the abi
Electronics Forum | Fri Jan 16 16:36:37 EST 2009 | rwyman
We've used our standard chipbonder- Heraeus PD944- for this type of application. While it does cure before reflow, when the part is placed onto the site, the material compresses and spreads and thus that potential standoff isn't an issue. We've als
